IP Library Granted Patent US 9,165,769
Granted Patent B1
US 9,165,769 · App. 14/738,725 · Granted Oct 20, 2015

Fine pattern structures having block co-polymer materials

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Quick Facts
Patent No.
US 9,165,769
App. No.
14/738,725
Granted
Oct 20, 2015
Kind
B1
Abstract

A fine pattern structure includes a layer having or including alternating protrusion portions and recess portions, polymer patterns disposed in recess regions formed by the recess portions, brush patterns disposed on top surfaces of the protrusion portions, and a block co-polymer layer including first polymer block patterns formed on the brush patterns and second polymer block patterns formed on the polymer patterns.

Claims (21)

1. A fine pattern structure, the structure comprising:

a layer including alternating protrusion portions and recess portions;

polymer patterns disposed in recess regions of the recess portions;

brush patterns disposed on top surfaces of the protrusion portions; and

a block co-polymer layer, the block co-polymer layer including first polymer block patterns disposed on the brush patterns and second polymer block patterns disposed on the polymer patterns,

wherein top surfaces of the polymer patterns are coplanar with the top surfaces of the protrusion portions,

wherein the first polymer block patterns are aligned with the brush patterns, and

wherein the second polymer block patterns are aligned with the polymer patterns.

2. The fine pattern structure of claim 1 , wherein the layer is a semiconductor layer or an insulation layer.

3. The fine pattern structure of claim 1 , wherein a width of each of the recess portions is equal to or less than a width of each of the protrusion portions.

4. The fine pattern structure of claim 1 , further comprising:

material patterns disposed under the polymer patterns in the recess regions of the recess portions.

5. The fine pattern structure of claim 4 , wherein the material patterns include a metal pattern.

6. The fine pattern structure of claim 1 ,

wherein the brush patterns include a material that chemically reacts with the first polymer block patterns; and

wherein the polymer patterns include a material that chemically reacts with the second polymer block patterns.

7. The fine pattern structure of claim 1 ,

wherein the brush patterns and the first polymer block patterns are polystyrene (PS) block patterns; and

wherein the polymer patterns and the second polymer block patterns are polymethylmethacrylate (PMMA) block patterns.

8. The fine pattern structure of claim 1 , wherein the layer includes a silicon (Si) and each of the brush patterns includes a polymer layer having hydroxyl terminal groups (—OH).

9. The fine pattern structure of claim 1 , wherein the polymer patterns are buried polymer patterns.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067335/0246 →