Liquid cooling system for a server
A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
1. A cooling system for a computer rack for housing at least a first server module a second server module, the cooling system comprising:
a first module liquid cooling loop, comprising:
a first cold plate dimensioned to thermally couple to a portion of the first server module;
a first hot plate; and
a first plurality of conduits to circulate a first liquid coolant through the first cold plate and the first hot plate;
a second module liquid cooling loop, comprising:
a second cold plate dimensioned to thermally couple to a portion of the second server module;
a second hot plate; and
a second plurality of conduits to circulate a second liquid coolant through the second cold plate and the second hot plate;
a rack liquid cooling loop, comprising:
a third cold plate that thermally couples to the first hot plate;
a fourth cold plate that thermally couples to the second hot plate;
a cooling unit; and
a third plurality of conduits to circulate a third liquid coolant through the third cold plate, the fourth cold plate, and the cooling unit;
wherein the third cold plate and the fourth cold plate are positioned external to the first server module and the second server module, respectively.
2. The cooling system of claim 1 , wherein at least one of the first module liquid cooling loop, the second module liquid cooling loop, and the rack liquid cooling loop is an open loop.
3. The cooling system of claim 1 , wherein the cooling unit includes at least one of a chiller or a heat exchanger.
4. The cooling system of claim 1 , wherein the cooling unit transfers heat from the computer rack to an HVAC system.
5. The cooling system of claim 1 , wherein the first server module includes at least one electronic heat generating device and the first cold plate and the second cold plate thermally couple to the electronic heat generating device.
6. The cooling system of claim 1 , wherein at least one of the first hot plate or the first cold plate includes a reservoir for receiving the first liquid coolant.
7. The cooling system of claim 6 , wherein at least one of the first hot plate or the first cold plate includes a plurality of fins that project into the reservoir.
8. The cooling system of claim 1 , wherein a thermal interface pad is positioned between at least one of the first hot plate and the third cold plate or the second hot plate and the fourth cold plate.
9. The cooling system of claim 1 , wherein each of the first server module and the second server module are substantially sealed to inhibit a flow of air into and out of the first server module and the second server module.
10. The cooling system of claim 1 , wherein the rack liquid cooling loop is associated with a system for cooling a server room in which the computer rack is contained.
11. The cooling system of claim 1 , wherein the third plurality of conduits circulates the third liquid coolant from within a server room containing the computer rack to a location external to the server room.