Method of manufacturing resin-encapsulated semiconductor device, and lead frame
View Patent ↗A resin-encapsulated semiconductor device comprises a semiconductor chip mounted on a die pad. A plurality of leads each having an inner lead and an outer lead are arranged in spaced relation from the die pad with the inner leads facing the die pad. A metal plating layer is formed on top surfaces of the inner leads, and the inner leads are connected by metal wires to the semiconductor chip. An encapsulation resin encapsulates the semiconductor chip, die pad, metal wires and inner leads leaving the outer leads exposed. The outer edge of the metal plating layer coincides with the outer surface of the encapsulation resin and with the outer edge of the metal plating layer.
1. A resin-encapsulated semiconductor device, comprising:
a plurality of leads each comprising an inner lead and an outer lead;
a die pad;
a semiconductor chip disposed on the die pad;
a metal plating layer formed on at least a top surface of each of the inner leads;
metal wires connecting the semiconductor chip and the metal plating layer on the top surfaces of the inner leads;
an encapsulation resin disposed on the semiconductor chip, the die pad, the metal wires and the inner leads having the metal plating layer, wherein the outer leads are exposed from the encapsulation resin, and an outer edge of the metal plating layer on the top surfaces of the inner leads coincides with an outer surface of the encapsulation resin; and
a solder plating layer disposed on a top surface of each of the outer leads, an inner edge of the solder plating layer coinciding with the outer edge of the metal plating layer on the top surfaces of the inner leads.
2. A resin-encapsulated semiconductor device according to claim 1 , wherein the metal plating layer is coated only on the top surface of each of the plurality of leads.
3. A resin-encapsulated semiconductor device, comprising:
a plurality of leads each comprising an inner lead and an outer lead;
a die pad;
a semiconductor chip disposed on the die pad;
a metal plating layer formed on a top surface and a side surface of each of the plurality of leads;
metal wires connecting the semiconductor chip and the metal plating layer on the top surfaces of the inner leads;
an encapsulation resin disposed on the semiconductor chip, the die pad, the metal wires and the inner leads having the metal plating layer, wherein the outer leads are exposed from the encapsulation resin, and an outer edge of the metal plating layer coincides with an outer surface of the encapsulation resin; and
a solder plating layer disposed on the outer leads, an inner edge of the solder plating layer coinciding with the outer edge of the metal plating layer.
4. A resin-encapsulated semiconductor device, comprising:
a plurality of leads each comprising an inner lead and an outer lead;
a die pad;
a semiconductor chip disposed on the die pad;
a metal plating layer formed on a top surface, a side surface, and a bottom surface of each of the plurality of leads;
metal wires connecting the semiconductor chip and the metal plating layer on the top surfaces of the inner leads;
an encapsulation resin disposed on the semiconductor chip, the die pad, the metal wires and the inner leads having the metal plating layer, wherein the outer leads are exposed from the encapsulation resin, and an outer edge of the metal plating layer coincides with an outer surface of the encapsulation resin; and
a solder plating layer disposed on the outer leads, an inner edge of the solder plating layer coinciding with the outer edge of the metal plating layer.
5. A resin-encapsulated semiconductor device according to claim 1 , wherein the metal plating layer is coated on the top surface and a side surface of each of the plurality of leads.
6. A resin-encapsulated semiconductor device according to claim 1 , wherein the metal plating layer is coated on the top surface, a side surface, and a bottom surface of each of the plurality of leads.