Flexible building-integrated photovoltaic structure
View Patent ↗Improved BIPV materials configured to meet various long-term requirements including, among others, a high degree of water resistance, physical durability, electrical durability, and an ability to withstand variations in temperature and other environmental conditions. In some embodiments, the disclosed BIPV materials include modules wherein two or more layers of the module are configured to be joined together during lamination to protect edge portions of the top sheet and/or back sheet of the module, such as in the vicinity of any multi-layer vapor barrier structure(s) of the module.
1. A method of manufacturing a photovoltaic module, comprising:
providing a bottom sheet including a back sheet and a bottom encapsulant layer overlying a radiation incident side of the back sheet;
disposing a plurality of electrically interconnected photovoltaic cells overlying a radiation incident side of the bottom encapsulant layer, each cell including a semiconductor absorber layer and a substrate upon which the absorber layer is supported;
preparing a standalone top sheet structure by performing the following steps:
constructing a vapor barrier structure by disposing a vapor barrier between first and second layers of insulating material;
placing an upper encapsulant layer overlying a radiation incident side of the vapor barrier structure;
placing an upper protective layer overlying a radiation incident side of the upper encapsulant layer; and
performing a first lamination process to laminate together the upper protective layer, the upper encapsulant layer and the vapor barrier structure;
placing the top sheet structure overlying a radiation incident side of the cells; and
laminating the top sheet structure to the bottom sheet in a second lamination process so that at least one of the upper protective layer and the upper encapsulant layer joins with at least one of the bottom encapsulant layer and the back sheet to cover and protect the edge portions of the vapor barrier structure.
2. The method of claim 1 , wherein the bottom sheet further includes an adhesive layer configured to join the module to a building surface.
3. The method of claim 1 , wherein subsequent to the second lamination process, a cross sectional area of the bottom encapsulant layer near edge portions of the module is substantially reduced compared to a corresponding cross sectional area of the bottom encapsulant layer in an interior portion of the module.
4. The method of claim 1 , wherein the upper encapsulant layer extends beyond the edge portions of the vapor barrier structure prior to the second lamination process, and is joined with at least one of the bottom encapsulant layer and the back sheet during the second lamination process.
5. The method of claim 1 , wherein preparing the top sheet structure includes placing a lower encapsulant layer on a side of the vapor barrier structure opposite the radiation incident side.
6. The method of claim 5 , wherein the first lamination process causes the lower encapsulant layer to be joined with at least one of the upper protective layer and the upper encapsulant layer.
7. A method of manufacturing a standalone top sheet structure for a photovoltaic cell, comprising:
constructing a vapor barrier structure by positioning a vapor barrier layer between underlying and overlying layers of insulating material;
positioning an upper encapsulant layer overlying a radiation incident side of the vapor barrier structure;
positioning an upper protective layer overlying a radiation incident side of the upper encapsulant layer; and
laminating the vapor barrier structure, the upper encapsulant layer and the upper protective layer together.
8. The method of claim 7 , wherein the vapor barrier layer is constructed from a metal-oxide material.
9. The method of claim 7 , further comprising positioning a first ultraviolet blocking layer between the vapor barrier layer and the overlying layer of insulating material.
10. The method of claim 9 , further comprising positioning a second ultraviolet blocking layer between the vapor barrier layer and the underlying layer of insulating material.
11. The method of claim 7 , further comprising positioning a lower encapsulant layer on a side opposite the radiation incident side of the vapor barrier structure, and wherein the lamination step includes laminating the lower encapsulant layer together with the vapor barrier structure, the upper encapsulant layer and the upper protective layer.
12. The method of claim 11 , wherein prior to laminating, the lower encapsulant layer has a width less than a corresponding width of the vapor barrier structure, and wherein laminating causes the lower encapsulant layer to be squeezed laterally outward beyond the edge portions of the vapor barrier structure.
13. The method of claim 7 , wherein after its manufacture, the standalone top sheet structure has a cross sectional thickness in the range of 280-800 micrometers.
14. A method of manufacturing a top sheet structure for a photovoltaic cell, comprising:
positioning a vapor barrier layer between lower and upper layers of insulating material;
positioning an upper encapsulant layer overlying the upper layer of insulating material;
positioning an upper protective layer overlying the upper encapsulant layer; and
laminating all of the layers together;
wherein the resulting laminated top sheet structure is configured as a standalone structure that may be laminated to a photovoltaic module in a further lamination step.
15. The method of claim 14 , wherein the vapor barrier layer is constructed from a metal-oxide material.
16. The method of claim 14 , further comprising positioning a first ultraviolet blocking layer between the vapor barrier layer and the upper layer of insulating material.
17. The method of claim 16 , further comprising positioning a second ultraviolet blocking layer between the vapor barrier layer and the lower layer of insulating material.
18. The method of claim 14 , further comprising positioning a lower encapsulant layer adjacent the lower layer of insulating material on a side opposed the vapor barrier layer, and wherein laminating all of the layers together includes laminating the lower encapsulant layer together with the remaining layers.
19. The method of claim 18 , wherein prior to laminating, the lower encapsulant layer has a width less than a corresponding width of the vapor barrier layer, and wherein laminating causes the lower encapsulant layer to be squeezed laterally outward beyond the edge portions of the vapor barrier layer.
20. The method of claim 14 , wherein the laminated top sheet structure has a cross sectional thickness in the range of 280-800 micrometers.