Granted Patent B2

US 9,920,893 · App. 14/743,420 · Granted Mar 20, 2018

Abstract

Claims (45)

1. A bus line LED module including a printed circuit board, said printed circuit board having LEDs mounted on the top thereof and a lens portion positioned over the LEDs on the printed circuit board, said bus line module comprising:

a pair of wires having an insulated outer portion and a metal inner portion for conducting electrical energy to the printed circuit board, each of said wires in said pair of wires having a section of the insulated outer portion removed to expose the metal inner portion therein;

a bottom portion assembly including:

a block molded over said insulated outer portion of said pair of wires, said block including windows formed therein to provide access to said exposed metal inner portion within said wires;

a top portion assembly including:

the printed circuit board and the lens portion;

a pair of metal pin connectors electrically connected to the printed circuit board and extending outwardly from the bottom of the printed circuit board;

whereby when said top portion assembly is placed on said bottom portion assembly, said pair of metal pin connectors will pass through said windows in said block and make metal-to-metal contact with said exposed metal inner portion within said wires and the lens portion will contact the top of said block to enable the forming of a sealing connection between said top portion assembly and said bottom portion assembly.

2. The bus line LED module as defined in claim 1 wherein said sealing connection is a vibration connection.

3. The bus line LED module as defined in claim 1 wherein said sealing connection is a sonic weld connection.

4. The bus line LED module as defined in claim 1 wherein said sealing connection is a heat staking connection.

5. The bus line LED module as defined in claim 1 wherein said sealing connection is a compressed heat gasket.

6. The bus line LED module as defined in claim 1 wherein said sealing connection is a compressed glue gasket.

7. The bus line LED module as defined in claim 1 wherein said sealing connection is a compressed chemical gasket.

8. The bus line LED module as defined in claim 1 wherein said pin connector is a T-shaped pin.

9. The bus line LED module as defined in claim 1 wherein said pin connector is an L-shaped pin.

10. A bus line LED module including a printed circuit board, said printed circuit board having LEDs mounted on the top thereof and a lens portion positioned over the LEDs on the printed circuit board, said bus line LED module comprising:

a pair of wires having an insulated outer portion and a metal inner portion for conducting electrical energy to the printed circuit board;

a bottom portion assembly including:

a printed circuit board support having a pair of channels formed in the bottom thereof and a pair of openings formed therethrough;

a top portion assembly including:

the printed circuit board and the lens portion;

a pair of insulation displacement connection connectors electrically connected to the printed circuit board and extending outwardly from the bottom of the printed circuit board;

whereby when said top portion assembly is placed on said bottom portion assembly, said pair of insulation displacement connection connectors will pass through said pair of openings formed in said printed circuit board support, displace the insulation in the insulated outer portion of the wires and make metal-to-metal contact with said metal inner portion of the wires, and the lens portion will contact the top of said printed circuit board support to enable the forming of a sealing connection between said top portion assembly and said bottom portion assembly, and a sealing connection around said openings in said printed circuit board support when said wires are within said channels on the bottom of said printed circuit board support.

11. The bus line LED module as defined in claim 10 wherein said sealing connections are vibration connections.

12. The bus line LED module as defined in claim 10 wherein said sealing connections are sonic weld connections.

13. The bus line LED module as defined in claim 10 wherein said sealing connections are heat staking connections.

14. The bus line LED module as defined in claim 10 wherein said sealing connections are compressed heat gaskets.

15. The bus line LED module as defined in claim 10 wherein said sealing connections are compressed glue gaskets.

16. The bus line LED module as defined in claim 10 wherein said sealing connections are compressed chemical gaskets.

17. The bus line LED module as defined in claim 10 wherein:

said sealing connection between said top portion assembly and said bottom portion assembly is selected from a group including a vibration connection, a sonic weld connection, a heat staking connection, a compressed heat gasket, a compressed glue gasket, and a compressed chemical gasket; and

said sealing connection around said openings in said printed circuit board support when said wires are in said channels on the bottom of said printed circuit board support is selected from a group including a vibration connection, a sonic weld connection, a heat staking connection, a compressed heat gasket, a compressed glue gasket, and a compressed chemical gasket.

18. A method of connecting a printed circuit board with LEDs mounted thereon and a lens portion positioned over the LEDs on the printed circuit board to a pair of wires having an insulated outer portion and a metal inner portion, said method comprising:

exposing a section of the metal inner portion of the wires within each of said wires;

forming a block over said pair of wires, said block having windows formed therein to provide access to the exposed metal inner portion of the wires within each of said wires;

forming a top portion assembly using the printed circuit board and the lens portion and further including a pair of metal pin connectors electrically connected to and extending outwardly from the bottom of the printed circuit board; and

connecting said top portion assembly to said block so that said metal pin connectors pass through said windows in said block and make metal-to-metal contact with said exposed section of the metal inner portion of said wires thereby enabling physical contact between the bottom of the lens portion and the top of said block so that a sealing connection can be made therebetween.

19. A method of connecting a printed circuit board with LEDs mounted thereon and a lens portion positioned over the LEDs on the printed circuit board to a pair of wires having an insulated outer portion and a metal inner portion, said method comprising:

forming a top portion assembly using the printed circuit board and the lens portion and further including a pair of insulation displacement connection connectors electrically connected to and extending outwardly from the bottom of the printed circuit board;

placing a printed circuit board support under said printed circuit board, said printed circuit board support having channels formed on the bottom thereof and openings formed to accommodate the passage of said insulation displacement connection connectors therethrough;

placing the wires within said channels formed on the bottom of the printed circuit board support;

causing said insulation displacement connection connectors to move through said insulated outer portion of said wires to make metal-to-metal to metal contact with the metal inner portion of the wires;

forming a seal between the lens portion and the printed circuit board support; and

forming a seal around the openings formed to accommodate the passage of said insulation displacement connection connectors therethrough.

Assignments (8)