Systems and devices for achieving high throughput attachment and sub-micron alignment of components
View Patent ↗Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
1. A device for bonding electrical components, comprising:
a chuck including:
a top layer including a vacuum hole for holding a component, and
a bottom layer comprising a translucent material, wherein the bottom layer is directly attached to the top layer; and
a fixture for holding the chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck.
2. The device of claim 1 , wherein the top layer comprises silicon carbide.
3. The device of claim 1 , wherein the translucent material comprises glass sapphire.
4. The device of claim 1 , further including a first stress absorption layer positioned between at least one of the plurality of alignment features and the chuck.
5. The device of claim 1 , further including a first stress absorption layer positioned between the top layer and at least one of the plurality of alignment features, and a second stress absorption layer positioned between the bottom layer and at least one of the plurality of alignment features.
6. The device of claim 1 , wherein the top layer includes a first layer and a second layer.
7. The device of claim 6 , wherein the first layer of the top layer comprises zirconia.
8. The device of claim 7 , wherein the second layer of the top layer comprises machinable glass ceramic.
9. The device of claim 6 , wherein the translucent material comprises glass sapphire.
10. A device for bonding components, comprising:
a chuck including:
a top layer including a vacuum hole for holding an electrical component, and
a bottom layer comprising a translucent material,
wherein the bottom layer is directly attached to the top layer; and
a fixture for holding the chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck; and
a first stress absorption layer positioned between the chuck and the fixture.
11. The device of claim 10 , wherein the top layer comprises silicon carbide.
12. The device of claim 10 , wherein the bottom layer comprises glass sapphire.
13. The device of claim 10 , wherein the first stress absorption layer is positioned between the top layer of the chuck and the fixture, and wherein the device further comprises a second stress absorption layer that is positioned between the bottom layer of the chuck and the fixture.
14. The device of claim 10 , wherein the top layer includes a first layer and a second layer, the first layer of the top layer comprises zirconia, and the second layer of the top layer comprises machinable glass ceramic.
15. The device of claim 14 , wherein the bottom layer comprises glass sapphire.
16. The device of claim 1 , wherein the top layer is substantially parallel to the bottom layer.
17. The device of claim 1 , wherein the top layer and the bottom layer are each substantially flat.
18. The device of claim 1 , wherein the top layer comprises a first material and the bottom layer comprises a second material different from the first material.