Composition of a solder, and method of manufacturing a solder connection
View Patent ↗The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
1. A structure comprising:
a substrate with a bonding area comprising a metal that oxidizes on contact with air;
a layer of a solder composition disposed over the bonding area, wherein particles of a thermodynamically metastable alloy are dispersed in the solder composition; and
an adhesion layer comprising an intermetallic compound, the intermetallic compound comprising the metal that oxidizes on contact with air and an element of the thermodynamically metastable alloy, wherein the adhesion layer is disposed between the metal that oxidizes on contact with air and the layer of solder composition.
2. The structure as claimed in claim 1 , wherein the element is Sn and the solder composition comprises Sn.
3. The structure as claimed in claim 1 , wherein the dispersed particles are present in a weight concentration of 50% to 60%.
4. The structure as claimed in claim 1 , wherein the dispersed particles are present in a weight concentration of 10% to 90%.
5. The structure as claimed in claim 1 , wherein the dispersed particles have an average diameter between 0.5 and 80 mm.
6. The structure as claimed in claim 1 , wherein the dispersed particles have an average diameter between 1 and 20 mm.
7. The structure as claimed in claim 1 , wherein the element is chosen from the group consisting of Sn, Zn, In, Al and Bi.