IP Library Granted Patent US 10,535,790
Granted Patent B2
US 10,535,790 · App. 14/750,821 · Granted Jan 14, 2020

One-dimensional metallization for solar cells

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Quick Facts
Patent No.
US 10,535,790
App. No.
14/750,821
Granted
Jan 14, 2020
Kind
B2
Abstract

Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

Claims (28)

1. A solar cell, comprising:

a substrate having a back surface and an opposing light-receiving surface;

a plurality of alternating N-type and P-type semiconductor regions disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell;

a conductive contact structure disposed on the plurality of alternating N-type and P-type semiconductor regions, the conductive contact structure comprising a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell, wherein the plurality of metal lines terminates in a staggered fashion at first and second ends of the substrate, and wherein the staggered fashion comprises alternating long terminations along the first direction relative to short terminations along the first direction for neighboring ones of the plurality of metal lines, and wherein the lines that have long terminations are discontinuous from one another, and the lines that have short terminations are discontinuous from one another, and wherein the staggered fashion conforms to angled corners of the substrate including alternating long terminations along the first direction relative to short terminations along the first direction for neighboring ones of the plurality of metal lines along the angled corners; and

an interconnect structure comprising extension portions that overlap the long terminations along the angled corners of the substrate, wherein each extension portion has a first edge substantially parallel with a second edge.

2. The solar cell of claim 1 , wherein the conductive contact structure further comprises a metal seed layer disposed between the plurality of alternating N-type and P-type semiconductor regions and the plurality of metal lines.

3. The solar cell of claim 1 , wherein the substrate is a monocrystalline silicon substrate, and wherein the plurality of alternating N-type and P-type semiconductor regions is a plurality of N-type and P-type diffusion regions formed in the silicon substrate.

4. The solar cell of claim 1 , wherein the plurality of alternating N-type and P-type semiconductor regions is a plurality of N-type and P-type polycrystalline silicon regions formed above the back surface of the substrate.

5. A photovoltaic assembly, comprising:

first and second solar cells, each of the first and second solar cells comprising:

a substrate having a back surface and an opposing light-receiving surface;

a plurality of alternating N-type and P-type semiconductor regions disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell; and

a conductive contact structure disposed on the plurality of alternating N-type and P-type semiconductor regions, the conductive contact structure comprising a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell, wherein the plurality of metal lines terminates in a staggered fashion at first and second ends of the substrate, and wherein the staggered fashion comprises alternating long terminations along the first direction relative to short terminations along the first direction for neighboring ones of the plurality of metal lines, and wherein the lines that have long terminations are discontinuous from one another, and the lines that have short terminations are discontinuous from one another, and wherein the staggered fashion conforms to angled corners of the substrate including alternating long terminations along the first direction relative to short terminations along the first direction for neighboring ones of the plurality of metal lines along the angled corners; and

an interconnect structure electrically coupling the first and second solar cells between the second end of the substrate of the first solar cell and the first end of the substrate of the second solar cell, the interconnect structure disposed over and electrically contacting first alternating ones of the plurality of metal lines of the first solar cell but not disposed over second alternating ones of the plurality of metal lines of the first solar cell, and the interconnect structure disposed over and electrically contacting first alternating ones of the plurality of metal lines of the second solar cell but not disposed over second alternating ones of the plurality of metal lines of the second solar cell wherein the interconnect structure comprises extension portions that overlap the long terminations along the angled corners of the substrates, wherein each extension portion has a first edge substantially parallel with a second edge.

6. The photovoltaic assembly of claim 5 , wherein the interconnect structure comprises one or more stress relief cuts formed therein.

7. The photovoltaic assembly of claim 5 , wherein, from a perspective taken from the light-receiving surface, portions of the interconnect structure exposed between the first and second solar cells are covered with a cloaking layer.

8. The photovoltaic assembly of claim 5 , wherein the interconnect structure is bonded to each of the first alternating ones of the plurality of metal lines of the first solar cell and to each of the first alternating ones of the plurality of metal lines of the second solar cell.

9. The photovoltaic assembly of claim 5 , wherein the conductive contact structure of each of the first and second solar cells further comprises a metal seed layer disposed between the plurality of alternating N-type and P-type semiconductor regions and the plurality of metal lines.

10. The photovoltaic assembly of claim 5 , wherein, for each of the first and second solar cells, the substrate is a monocrystalline silicon substrate, and the plurality of alternating N-type and P-type semiconductor regions is a plurality of N-type and P-type diffusion regions formed in the silicon substrate.

11. The photovoltaic assembly of claim 5 , wherein, for each of the first and second solar cells, the plurality of alternating N-type and P-type semiconductor regions is a plurality of N-type and P-type polycrystalline silicon regions formed above the back surface of the substrate.

12. A solar cell, comprising:

a substrate having a back surface and an opposing light-receiving surface;

a plurality of semiconductor regions disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell;

a conductive contact structure disposed on the plurality of semiconductor regions, the conductive contact structure comprising a plurality of metal lines corresponding to the plurality of semiconductor regions parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell, wherein the plurality of metal lines terminates in a staggered fashion at first and second ends of the substrate, and wherein the staggered fashion comprises alternating long terminations along the first direction relative to short terminations along the first direction for neighboring ones of the plurality of metal lines, and wherein the lines that have long terminations are discontinuous from one another, and the lines that have short terminations are discontinuous from one another, and wherein the staggered fashion conforms to angled corners of the substrate including alternating long terminations along the first direction relative to short terminations along the first direction for neighboring ones of the plurality of metal lines along the angled corners; and

an interconnect structure comprising extension portions that overlap the long terminations along the angled corners of the substrate, wherein each extension portion has a first edge substantially parallel with a second edge.

13. The solar cell of claim 12 , wherein the conductive contact structure further comprises a metal seed layer disposed between the plurality of semiconductor regions and the plurality of metal lines.

14. The solar cell of claim 12 , wherein the substrate is a monocrystalline silicon substrate, and wherein the plurality of semiconductor regions is a plurality of diffusion regions formed in the silicon substrate.

15. The solar cell of claim 12 , wherein the plurality of semiconductor regions is a plurality of polycrystalline silicon regions formed above the back surface of the substrate.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2025
From: TOTALENERGIES SE
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 072946/0828 →
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062699/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2016
From: SEWELL, RICHARD HAMILTON; KAVULAK, DAVID FREDRIC JOEL; ABRA, LEWIS; PASS, THOMAS P.; KIM, TAESEOK; HSIA, BENJAMIN IAN; HARLEY, GABRIEL
To: SUNPOWER CORPORATION
Reel/Frame 039438/0483 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2016
From: MOORS, MATTHIEU
To: TOTAL MARKETING SERVICES
Reel/Frame 039438/0475 →