Electronic/photonic chip integration and bonding
View Patent ↗An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.
1. An optical waveguide device comprising:
one or more photonic chips, the one or more photonic chips including:
a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and
a second portion of a photonic chip comprising:
an array of second components each having an electrical input and an optical output, and
a plurality of output waveguides each connected to the optical output of a respective second component,
the second components and the output waveguides being within one plane parallel to a surface of the second portion of a photonic chip;
the optical waveguide device further comprising a complementary metal oxide semiconductor (CMOS) integrated circuit, the CMOS integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components;
wherein the CMOS integrated circuit is configured:
to receive a first electrical signal corresponding to modulation carried by light received by a first one of the first components,
to process the first electrical signal to form a first processed electrical signal, the processing comprising reshaping and/or retiming of the electrical signal, and
to provide the first processed electrical signal to a first one of the second components,
wherein the CMOS integrated circuit has a perimeter having:
a first side, and
a second side, different from the first side,
wherein each of a plurality of electrical contacts on the first side is connected to the electrical output of a respective first component of the array of first components, and no electrical contact on the first side is connected to a modulator,
wherein each of a plurality of electrical contacts on the second side is connected to the electrical input of a respective second component of the array of second components, and no electrical contact on the second side is connected to a photodetector,
wherein the second components are modulators, each having an input waveguide and an output waveguide, there being one or more electrical paths between the first components and the modulators and
wherein at least one of the electrical paths extends over:
an input waveguide;
an output waveguide; or
a modulator.
2. The optical waveguide device of claim 1 , wherein the integrated circuit is directly mounted onto the first portion of a photonic chip and/or the second portion of a photonic chip.
3. The optical waveguide device according to claim 1 , wherein each of the first components is a photodetector.
4. The optical waveguide device according to claim 1 , wherein the integrated circuit is flip chip mounted onto at least one of the first portion of a photonic chip and the second portion of a photonic chip.
5. The optical waveguide device according to claim 1 , wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip; and
wherein the integrated circuit is electrically connected to each of the first components and the second components by respective wire bonds.
6. The optical waveguide device according to claim 1 , wherein the first portion of a photonic chip is a portion of a first photonic chip and the second portion of a photonic chip is a portion of a second photonic chip, the second photonic chip being separate from the first photonic chip.
7. The optical waveguide device according to claim 1 , wherein the first portion of a photonic chip is a portion of a first photonic chip and the second portion of a photonic chip is a portion of the same photonic chip.
8. The optical waveguide device of claim 7 , wherein the integrated circuit is located directly on the photonic chip but does not overlap vertically with either of the first components or the second components.
9. The optical waveguide device according to claim 1 , wherein each component in the array of first components is displaced laterally with respect to adjacent first components such that the array of first components has a stepped arrangement.
10. The optical waveguide device of claim 9 , wherein each component in the array of second components is displaced laterally with respect to adjacent second components such that the array of second components has a stepped arrangement.
11. The optical waveguide device of claim 10 , wherein each of the first components is associated with a respective one of the array of second components, and wherein the length of the electrical connection between each first component and its respective second component is equal to the length of the electrical connection between each of the other first components and their respective second components.
12. The optical waveguide device according to claim 1 , wherein the integrated circuit is an application-specific integrated circuit (ASIC).
13. The optical waveguide device of claim 12 , wherein the first components are photodetectors, and the integrated circuit is an ASIC which electrically connects the photodetectors with the modulators to form a plurality of detector remodulators.
14. The optical waveguide device of claim 13 wherein the ASIC is configured:
to receive packets from the photodetectors, and the ASIC includes a packet processor for processing the packet information the ASIC receives from the photodetectors; and
to process the packet information before sending the electrical signals to the modulators.
15. The optical waveguide device of claim 13 , wherein the integrated circuit includes a wavelength tuner configured to control the wavelength of a wavelength tuned laser connected to one or more of the modulators.
16. The optical waveguide device of claim 1 ,
wherein the integrated circuit is flip chip mounted onto the first and second portion of a photonic chip; and
wherein each of the first components is a photodetector.
17. An optical waveguide switch comprising:
an arrayed waveguide grating (AWG); and
an optical waveguide device according to claim 1 ,
the optical waveguide device being optically connected to the inputs of the AWG for controlling the wavelength of an optical signal at an input of the AWG and therefore for controlling the path taken by the optical signal through the AWG.
18. The optical waveguide device of claim 1 , wherein each of the second components is a modulator configured to receive an unmodulated optical signal at the optical input of the modulator, and to produce, at the optical output of the modulator, a modulated optical signal.
19. The optical waveguide device according to claim 1 , wherein the integrated circuit vertically overlaps a first component of the array of first components and/or a second component of the array of second components.
20. The optical waveguide device according to claim 1 ,
wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or
wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.
21. The optical waveguide device of claim 1 , wherein the CMOS integrated circuit is a packet processing CMOS integrated circuit.