IP Library Granted Patent US 9,703,327
Granted Patent B2
US 9,703,327 · App. 14/752,938 · Granted Jul 11, 2017

Fastenerless hinge which enables thin form factor low cost design

Inventors: Mark E. Sprenger (Folsom, CA); Kenan Arik (Hillsboro, OR); Drew G. Damm (Hillsboro, OR)
Assignee: Intel Corporation
G06F1/1681E05D7/10E05D7/1061G06F1/1616Y10T16/554
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Quick Facts
Patent No.
US 9,703,327
App. No.
14/752,938
Granted
Jul 11, 2017
Kind
B2
Abstract

The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.

Claims (16)

1. A notebook device, comprising:

a chassis supporting electronic circuitry therein; and

a hinge assembly coupled to the chassis, the hinge assembly comprising:

a hinge bracket;

wherein the hinge bracket has an elevated portion and a base portion thereby providing a hollow portion between the elevated portion and the base portion;

the hinge bracket further comprises at least one spring tab extending from the base portion towards the elevated portion into the hollow portion; and

a hinge wing slidably coupled to the hinge bracket through the hollow portion for frictional engagement with the at least one spring tab;

wherein an insertion force for inserting the hinge wing into the hollow of the hinge bracket is different than an extraction force for removing the hinge wing from the hollow of the hinge bracket due to the orientation of the at least one spring tab.

2. The notebook device of claim 1 , wherein the notebook device is a 2-in-1 device.

3. The notebook device of claim 1 , wherein the hinge bracket is within the chassis.

4. The notebook device of claim 1 , wherein a portion of the hinge bracket is translucent.

5. The notebook device of claim 1 , wherein the height of the hinge assembly is between 1.8 mm and 2.8 mm.

6. The notebook device of claim 1 , wherein the at least one spring tab has a spring force in the range of 0.75 lbs and 1.0 lbs.

7. The notebook device of claim 1 , wherein the dimensions of the hinge wing is approximately 10 mm by 15 mm.

8. The notebook device of claim 1 , wherein the extraction force required to remove the hinge wing from the hinge bracket is greater than the insertion force required to insert the hinge wing into the hinge bracket.

9. The notebook device of claim 8 , wherein the insertion force is between 1.0 lbs and 1.5 lbs and the extraction force is between 1.5 lbs and 2.0 lbs.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2017
From: SPRENGER, MARK; ARIK, KENAN; DAMM, DREW
To: INTEL CORPORATION
Reel/Frame 042035/0586 →
Continuity (1)
Related Publication 20160378146A1 · Dec 29, 2016