Optical device structure using GaN substrates and growth structures for laser applications

1. A device comprising:

a gallium and nitrogen containing surface having a {30-31} crystalline orientation;

a laser stripe region formed overlying a portion of the gallium and nitrogen containing surface, the laser stripe region being characterized by a cavity orientation parallel to a projection of the c-direction, the laser stripe region having a first end and a second end;

a first cleaved facet provided on the first end of the laser stripe region, the first cleaved facet comprising a first semipolar surface; and

a second cleaved facet provided on the second end of the laser stripe region, the second cleaved facet comprising a second semipolar surface,

wherein the first cleaved facet is substantially parallel with the second cleaved facet; the {30-31} crystalline orientation is selected from either (30-31) or (30-3-1); and the {30-31} crystalline orientation is off-cut less than +/−8 degrees toward or away from an a-plane.

2. The device of claim 1 wherein the first cleaved facet comprises a first mirror surface, the first mirror surface comprising a reflective coating, the reflective coating being selected from silicon dioxide, hafnia, titania, tantalum pentoxide, zirconia, or aluminum oxide.

3. The device of claim 2 wherein the first mirror surface is provided by a scribing process and a breaking process.

4. The device of claim 3 wherein the scribing process is performed by diamond scribing or laser scribing.

5. The device of claim 3 wherein the scribing process is performed with a laser using a top-side skip-scribe technique.

6. The device of claim 1 wherein the second cleaved facet comprises a second mirror surface.

7. The device of claim 6 wherein the second mirror surface comprises an anti-reflective coating.

8. A device comprising:

a gallium and nitrogen containing surface having a {30-31} crystalline orientation, the {30-31} crystalline orientation being selected from either (30-31) or (30-3-1);

an active region overlying a portion of the gallium and nitrogen containing surface;

a laser stripe region formed overlying the active region, the laser stripe region being characterized by a cavity orientation parallel to a projection of the c-direction, the laser stripe region having a first end and a second end;

a first facet provided on the first end of the laser stripe region, the first facet being substantially orthogonal to the laser stripe region and provided by a scribing process and a breaking process; and

a second facet provided on the second end of the laser stripe region, the second facet being substantially orthogonal to the laser stripe region and provided by the scribing process and the breaking process;

wherein the scribing process is performed with a laser using a top-side skip-scribe technique or a back-side scribing technique, the first facet is substantially parallel with the second facet, the {30-31} crystalline orientation is off-cut less than +/−8 degrees toward or away from an a-plane, and the active region is configured to emit light characterized by a wavelength ranging from about 500 nm to about 580 nm, or from about 430 nm to about 480 nm.

9. The device of claim 8 wherein the first facet comprises a first mirror surface, the first mirror surface comprising a reflective coating, the reflective coating being selected from silicon dioxide, hafnia, titania, tantalum pentoxide, zirconia, or aluminum oxide.

10. The device of claim 8 wherein the second facet comprises a second mirror surface, the second mirror surface comprising an anti-reflective coating.

11. The device of claim 8 wherein a length of the laser stripe region ranges from about 50 microns to about 3000 microns.