System and method for attaching solder balls and posts in antenna areas
Aspects of the present disclosure provide an apparatus for wireless communications. The apparatus generally includes a printed circuit board (PCB) and a plurality of antenna elements. Each of the plurality of antenna elements is mechanically attached to a perimeter of the PCB via one or more solder elements. Each of the solder elements are spaced apart from each other and electrically isolated from each other in a vicinity of the antenna elements.
1. An apparatus for wireless communication, comprising:
a printed circuit board (PCB); and
a plurality of antenna elements, each directly attached to a perimeter of the PCB via one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements.
2. The apparatus of claim 1 , wherein the solder elements are electrically isolated from the antenna elements.
3. The apparatus of claim 1 , wherein the one or more solder elements form a frame around the perimeter of the PCB.
4. The apparatus of claim 1 , wherein the plurality of antenna elements are evenly spaced along the perimeter of the PCB.
5. The apparatus of claim 1 , wherein the plurality of antenna elements are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.
6. The apparatus of claim 1 , wherein the plurality of antenna elements comprises a plurality of antenna elements packaged in a single unit.
7. A method, comprising:
positioning a plurality of antenna elements relative to a printed circuit board (PCB); and
directly attaching the antenna elements to the PCB using one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements.
8. The method of claim 7 , wherein the solder elements are electrically isolated from the antenna elements.
9. The method of claim 7 , wherein the one or more solder elements form a frame around the perimeter of the PCB.
10. The method of claim 7 , wherein the plurality of antenna elements are evenly spaced along the perimeter of the PCB.
11. The method of claim 7 , wherein the plurality of antenna elements are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.
12. The method of claim 7 , wherein the plurality of antenna elements comprises a plurality of antenna elements packaged in a single unit.
13. A wireless node, comprising:
a transceiver;
a printed circuit board (PCB); and
a plurality of antenna elements, each coupled to the transceiver and directly attached to a perimeter of the PCB via one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements.
14. The wireless node of claim 13 , wherein the solder elements are electrically isolated from the antenna elements.
15. The wireless node of claim 13 , wherein the one or more solder elements form a frame around a perimeter of the PCB.
16. The wireless node of claim 13 , wherein the plurality of antenna elements comprises an array of antenna elements, and wherein the plurality of antenna elements are evenly spaced along the perimeter of the PCB.
17. The wireless node of claim 13 , wherein the plurality of antenna elements are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.
18. The wireless node of claim 13 , wherein the plurality of antenna elements comprises a plurality of antenna elements packaged in a single unit.
19. An apparatus for wireless communications, comprising:
means for transmitting and receiving radio frequency signals; and
means for directly attaching the means for transmitting and receiving radio frequency signals to a printed circuit board (PCB), wherein the means for directly attaching are spaced apart and electrically isolated from each other in a vicinity of the means for transmitting and receiving radio frequency signals.
20. The apparatus of claim 19 , wherein the means for coupling are electrically isolated from the means for transmitting and receiving radio frequency signals.
21. The apparatus of claim 19 , wherein the means for coupling form a frame around the perimeter of the PCB.
22. The apparatus of claim 19 , wherein the means for transmitting and receiving radio frequency signals are evenly spaced along the perimeter of the PCB.
23. The apparatus of claim 19 , wherein the means for transmitting and receiving radio frequency signals are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.
24. The apparatus of claim 19 , wherein the means for transmitting and receiving radio frequency signals comprise means for transmitting and receiving radio frequency signals packaged in a single unit.