IP Library Granted Patent US 10,126,499
Granted Patent B2
US 10,126,499 · App. 14/754,994 · Granted Nov 13, 2018

Electro-optic device with semiconductor junction area and related methods

Inventors: Jean-Robert Manouvrier (Echirolles, FR); Jean-Francois Carpentier (Grenoble, FR); Patrick Lemaitre (Biviers, FR)
Assignees: STMICROELECTRONICS SA; STMICROELECTRONICS (CROLLES 2) SAS
G02B6/124G02B6/30G02B6/29395
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,126,499
App. No.
14/754,994
Granted
Nov 13, 2018
Kind
B2
Abstract

An electro-optic device may include a photonic chip having an optical grating coupler at a surface. The optical grating coupler may include a first semiconductor layer having a first base and first fingers extending outwardly from the first base. The optical grating coupler may include a second semiconductor layer having a second base and second fingers extending outwardly from the second base and being interdigitated with the first fingers to define semiconductor junction areas, with the first and second fingers having a non-uniform width. The electro-optic device may include a circuit coupled to the optical grating coupler and configured to bias the semiconductor junction areas and change one or more optical characteristics of the optical grating coupler.

Claims (25)

1. An electro-optic device comprising:

a photonic chip having an optical grating coupler at a surface thereof, the optical grating coupler comprising

a first semiconductor layer of a first conductivity type and comprising a first base and a first plurality of fingers extending outwardly therefrom, and

a second semiconductor layer of a second conductivity type comprising a second base and a second plurality of fingers extending outwardly therefrom and being interdigitated and in physical contact with said first plurality of fingers to define a plurality of semiconductor junction areas disposed between contacting sidewalls of the first plurality of fingers and the second plurality of fingers, said first and second pluralities of fingers having a non-uniform width; and

a circuit coupled to said optical grating coupler and configured to apply a first voltage to each of the first plurality of fingers and a second voltage to each of the second plurality of fingers to change at least one optical characteristic of the optical grating coupler.

2. The electro-optic device of claim 1 wherein top surfaces of said first plurality of fingers extends vertically away from a substrate and past top surfaces of said second plurality of fingers to define a plurality of recesses filled with a dielectric material respectively aligned with said second plurality of fingers.

3. The electro-optic device of claim 1 wherein said first base has first and second ends; and wherein said first plurality of fingers progressively increase in width from the first end to the second end.

4. The electro-optic device of claim 1 wherein said first and second pluralities of fingers are curved.

5. The electro-optic device of claim 1 wherein said photonic chip comprises first and second terminals coupled respectively to said first and second bases and configured to respectively receive the first voltage and the second voltage.

6. The electro-optic device of claim 1 wherein the at least one optical characteristic comprises at least one of a peak power wavelength, an optical loss, and a refractive index.

7. The electro-optic device of claim 1 further comprising an optical element defining an optical path above said optical grating coupler.

8. The electro-optic device of claim 7 wherein said optical element comprises an optical fiber.

9. A method of making an electro-optic device comprising:

forming a photonic chip having an optical grating coupler at a surface thereof, the optical grating coupler comprising

a first semiconductor layer of a first conductivity type and comprising a first base and a first plurality of fingers extending outwardly therefrom, and

a second semiconductor layer of a second conductivity type comprising a second base and a second plurality of fingers extending outwardly therefrom and being interdigitated and in physical contact with the first plurality of fingers to define a plurality of semiconductor junction areas between facing surfaces of the first plurality of fingers and the second plurality of fingers, the first and second pluralities of fingers having a non-uniform width; and

coupling a circuit to the optical grating coupler

applying, using the circuit, a first voltage to each of the first plurality of fingers and a second voltage to each of the second plurality of fingers, the applying being configured to bias the plurality of semiconductor junction areas and change at least one optical characteristic of the optical grating coupler.

10. The method of claim 9 wherein the first plurality of fingers extends vertically past the second plurality of fingers to define a plurality of recesses respectively aligned with the second plurality of fingers.

11. The method of claim 9 wherein the first base has first and second ends; and wherein the first plurality of fingers progressively increase in width from the first end to the second end.

12. The method of claim 9 wherein the first and second pluralities of fingers are curved.

13. The method of claim 9 wherein the photonic chip comprises first and second terminals coupled respectively to the first and second bases.

14. The method of claim 9 wherein the at least one optical characteristic comprises at least one of a peak power wavelength, an optical loss, and a refractive index.

15. The method of claim 9 further comprising coupling an optical element to define an optical path above the optical grating coupler.

16. The method of claim 15 wherein the optical element comprises an optical fiber.

Assignments (3)
CHANGE OF NAME Recorded Dec 8, 2023
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 065835/0159 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2015
From: MANOUVRIER, JEAN-ROBERT
To: STMICROELECTRONICS SA
Reel/Frame 036786/0838 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2015
From: CARPENTIER, JEAN-FRANCOIS; LEMAITRE, PATRICK
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 036786/0850 →
Continuity (1)
Related Publication 20170003449A1 · Jan 5, 2017