Circuit boards and methods of identification and manufacturing thereof

1. A circuit board comprising:

a surface configured to receive circuitry;

a first notch of a first selectable configuration formed in a first lateral edge of the surface,

wherein the first selectable configuration is configured to convey identifying information that identifies aspects relating to the circuit board; and

at least a portion of a partition feature intersecting with the first notch.

2. The circuit board according to claim 1 , wherein the first selectable configuration includes at least one of a location along the first lateral edge of the surface, a size, or a shape of the first notch.

3. The circuit board according to claim 2 , further comprising a second notch of a second selectable configuration formed in a second lateral edge of the surface, wherein the second selectable configuration is configured to convey identifying information that identifies the aspects relating to the circuit board.

4. The circuit board according to claim 3 , wherein the second selectable configuration includes at least one of a location along the second lateral edge of the surface, a size, or a shape of the second notch.

5. The circuit board according to claim 4 , wherein the first selectable configuration has at least one of a different size, shape, or location from the second selectable configuration.

6. The circuit board according to claim 3 , further comprising at least one additional notch, wherein each notch of the at least one additional notch has a selectable configuration on a third lateral edge of the surface and each selectable configuration is configured to convey identifying information that identifies aspects relating to the circuit board.

7. The circuit board according to claim 3 , wherein the first edge and second edge are a same edge of the surface.

8. A method of manufacturing a circuit board, the method comprising:

forming a first notch, having a first selectable configuration, on a perimeter of a surface of a first circuit board such that the first notch is located within the surface the first circuit board;

configuring the first selectable configuration to convey identifying information that identifies aspects relating to the first circuit board;

forming a first hole on or near the perimeter of the first circuit board such that the first hole is located within the surface of the first circuit board; and

forming a partition feature in a panel that contains the first circuit board,

wherein the partition feature and the first hole intersect.

9. The method according to claim 8 , wherein forming the first hole further comprises drilling the first hole through the surface of the first circuit board.

10. The method according to claim 8 , wherein forming the partition feature further comprises cutting a slot through the panel along the perimeter of the first circuit board.

11. The method according to claim 8 , wherein forming the first notch further comprises:

separating the first circuit board from the panel along the partition feature so that the perimeter of the separated first circuit board defines a first lateral edge, and the first hole defines the first notch in the first lateral edge.

12. The method according to claim 8 , wherein forming the partition feature further comprises cutting a groove in a surface of the panel along the perimeter of the first circuit board.

13. The method according to claim 8 , further comprising:

providing a second circuit board on the panel, wherein the second circuit board has a second surface with a perimeter, and the perimeters of the first and second circuit boards adjoin the partition feature;

forming a second notch having a second selectable configuration on the perimeter of the second circuit board such that the second notch is located within the second surface of the second circuit board; and

configuring the second selectable configuration to convey identifying information that identifies aspects relating to the second circuit board.

14. The method according to claim 13 , wherein forming the second notch further comprises:

forming a second hole on or near the perimeter of the second circuit board,

wherein the partition feature and the second hole intersect.

15. The method according to claim 13 , further comprising: separating the second circuit board from the panel along the partition feature so that the perimeter of the second circuit board defines a second lateral edge, and the second hole is formed in the second lateral edge.

16. The method according to claim 8 , further comprising forming the partition feature after the first hole is formed.

17. The method according to claim 8 , further comprising forming the partition feature before the first hole is formed.

18. The method according to claim 8 , wherein the partition feature partitions the surface of the first circuit board from a frame portion of the panel the method further comprising separating the first circuit board from the frame portion of the panel at the partition feature.

19. The method according to claim 8 , further comprising:

forming a second notch having a second selectable configuration on the perimeter of the first circuit board such that the second notch is located within the surface of the first circuit board; and

configuring the second selectable configuration to convey identifying information that identifies aspects relating to the first circuit board.

20. The circuit board according to claim 1 , further comprising a plurality of notches including the first notch, the plurality of notches formed in the first lateral edge of the surface and having a plurality of different sizes or shapes, or both, wherein a combination of one or more of the plurality of notches are configured to convey information relating to the circuit board.