Semiconductor element cooling structure and electronic apparatus provided with same
A structure for cooling a semiconductor element includes an element body and a lead terminal extending from one surface of the element body in a direction intersecting the one surface. The semiconductor element cooling structure includes a heat sink. The heat sink includes a contact surface that is in contact with the one surface of the element body, a through-hole which is formed in the contact surface and through which the lead terminal passes, and a space portion that communicates with the through-hole and that is configured to house a substrate connected to the lead terminal.
1. A semiconductor element cooling structure for cooling a semiconductor element, comprising:
a heat receiving unit configured to receive heat emitted from the semiconductor element; and
a heat radiation unit configured to radiate the heat from the heat receiving unit,
wherein:
the heat receiving unit includes an element contact portion having a contact surface to which one surface of the semiconductor element is fitted, and a heat diffusion portion that is contacted with the element contact portion and the heat radiation unit;
the element contact portion includes a space portion;
the contact surface includes a through-hole which communicates with the space portion and through which a terminal of the semiconductor element is inserted;
the space portion houses a substrate to which the terminal of the semiconductor element is connected; and
a thickness of the heat diffusion portion in a direction from the space portion to the heat radiation unit is in a range of 3 mm to 8 mm,
wherein the heat diffusion portion is disposed between the space portion and the heat radiation unit.
2. The semiconductor element cooling structure according to claim 1 , wherein the element contact portion and the heat diffusion portion are integrally formed.
3. The semiconductor element cooling structure according to claim 2 , wherein the heat receiving unit and the heat radiation unit are integrally formed.
4. The semiconductor element cooling structure according to claim 2 , wherein the heat receiving unit and the heat radiation unit are in contact with each other via a heat conductive substance.
5. The semiconductor element cooling structure according to claim 1 , wherein the substrate includes a socket into which the terminal is inserted.
6. The semiconductor element cooling structure according to claim wherein the heat radiation unit includes a plurality of fins.
7. The semiconductor element cooling structure according to claim 1 , wherein the semiconductor element comprises a light emitting element.
8. An electronic apparatus comprising the semiconductor element cooling structure according to claim 1 .
9. The electronic apparatus according to claim 8 , wherein the electronic apparatus comprises a projection type display apparatus.
10. The semiconductor element cooling structure according to claim 1 , wherein the contact surface includes a plurality of through-holes formed individually for each terminal of the semiconductor element.
11. The semiconductor element cooling structure according to claim 1 , further comprising a pressing member for pressing the semiconductor element to the heat receiving unit.
12. The semiconductor element cooling structure according to claim 11 , wherein the pressing member includes a through-hole through which a projected portion of the semiconductor element never passes.
13. The semiconductor element cooling structure according to claim 1 , wherein a heat conductivity of the space portion is less than a heat conductivity of the element contact portion.