Semiconductor device
View Patent ↗In order to provide a semiconductor device having high ESD tolerance, a plurality of source wirings ( 22 ) are formed of metal films having the same shape and electrically connect a plurality of sources ( 12 ) to a ground voltage wiring ( 22 a ), respectively, a plurality of drain wirings ( 23 ) are formed of metal films having the same shape and electrically connect a plurality of drains ( 12 ) to an input voltage wiring ( 23 a ), respectively, and a plurality of gate wirings ( 21 ) are formed of metal films having the same shape and electrically connect a plurality of gates ( 11 ) to the ground voltage wiring ( 22 a ), respectively. Further, a back gate wiring ( 24 ) is formed of a metal film and electrically connects a back gate ( 14 ) to the ground voltage wiring ( 22 a ), and the back gate wiring ( 24 ) is separated from the source wiring ( 22 ) formed on the source ( 12 ).
1. A semiconductor device, comprising:
an NMOS transistor for an ESD protection circuit, the NMOS transistor comprising:
a plurality of sources and a plurality of drains that are alternatively formed;
a plurality of even-numbered channels formed between the plurality of sources and the plurality of drains;
a plurality of gates formed above the plurality of even-numbered channels; and
a back gate formed close to a plurality of outermost sources among the plurality of sources;
a ground voltage wiring electrically connected to a ground voltage pad used for external connection;
an input voltage wiring electrically connected to an input voltage pad used for external connection;
a plurality of source wirings formed of metal films having the same shape, and electrically connecting the plurality of sources respectively to the ground voltage wiring;
a plurality of drain wirings formed of metal films having the same shape, and electrically connecting the plurality of drains respectively to the input voltage wiring;
a plurality of gate wirings formed of metal films, and electrically connecting the plurality of gates respectively to the ground voltage wiring; and
a back gate wiring formed of a metal film and is separated from the plurality of source wirings, and electrically connecting the back gate to the ground voltage wiring.
2. A semiconductor device according to claim 1 , wherein the plurality of gate wirings are formed of metal films having the same shape.