Adhesive composition and structure comprising at least one layer of said composition
View Patent ↗An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A having an average number of carbon atoms per nitrogen atom, denoted C A , ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B having an average number of carbon atoms per nitrogen atom, denoted C B , ranging from 7 to 10, advantageously from 7.5 to 9.5; and at least one unit denoted C having an average number of carbon atoms per nitrogen atom, denoted C C , ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.
1. A polyamide consisting of the following units:
at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted C A , ranging from 4 to 8.5;
at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted C B , ranging from 7 to 10;
at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted C C , ranging from 9 to 18; and
optionally at least one unit Z other than an amide unit;
one of the units A, B or C being in very predominant proportion in the polyamide and representing from 80% to 97% by weight relative to the total weight of the polyamide,
the mean number of carbon atoms per nitrogen atom of the units A, B and C also corresponding to the following strict inequality: C A <C B <C C ,
the heat of fusion of the polyamide being greater than 25 J/g (DSC),
the melting point of the polyamide being greater than 150° C. (DSC), and
wherein unit B is the very predominant unit in the polyamide.
2. The polyamide as claimed in claim 1 , wherein the polyamide consists of only one unit A, only one unit B and only one unit C.