Hermetically sealed illumination device with luminescent material and manufacturing method therefor
View Patent ↗An illumination device is manufactured by providing ( 101 ) a substrate ( 1 ) having a first side ( 1 a ), sealingly coupling ( 106 ) an at least partially light transmitting cover ( 2 ) to the substrate ( 1 ) such that an enclosed space ( 3 ) is defined by at least the first side ( 1 a ) of the substrate ( 1 ) and the cover ( 2 ), providing a through-hole ( 4 ) into the enclosed space ( 3 ), and introducing ( 107 ) a luminescent material into the enclosed space ( 3 ) via the through-hole ( 4 ). By hermetically sealing ( 108 ) the through-hole ( 4 ) after the introduction of the luminescent material, the enclosed space ( 3 ) becomes sealed and hence luminescent materials being relatively sensitive to e.g. water and/or oxygen become protected from exposure to the environment.
1. A method for manufacturing an illumination device, the method comprising:
providing a substrate having a first side provided with a light source;
providing an at least partially light transmitting cover sealingly coupled to the substrate such that a chamber is defined by at least the first side of the substrate and the cover;
providing a through-hole into the chamber;
introducing a luminescent material into the chamber via the through-hole such that a layer of luminescent material is provided on at least a portion of an inner surface of the cover; and
after the introduction of the luminescent material, sealing the through-hole with a sealing material that is different from the luminescent material, the sealing material being disposed in the through-hole and configured to protect the luminescent material from an environment of the illumination device.
2. The method according to claim 1 , further comprising forming capillary grooves on the inner surface of the cover prior to introducing the luminescent material into the chamber.
3. The method according to claim 1 , wherein providing the at least partially light transmitting cover sealingly coupled to the substrate comprises sealingly coupling the at least partially light transmitting cover to a thermally conductive element which is sealingly coupled to the substrate, wherein the chamber is further defined by the thermally conductive element.
4. The method according to claim 1 , wherein providing an at least partially light transmitting cover sealingly coupled to the substrate comprises sealingly coupling a thermally conductive element integrally formed with the at least partially light transmitting cover to the substrate, wherein the chamber is further defined by the thermally conductive element.
5. The method according to claim 1 , wherein providing an at least partially light transmitting cover sealingly coupled to the substrate comprises sealingly coupling a thermally conductive element integrally formed with the substrate to the at least partially light transmitting cover, wherein the chamber is further defined by the thermally conductive element.
6. The method according to claim 1 , further comprising providing an at least partially light transmitting envelope sealingly coupled to the substrate such that the at least partially light transmitting cover is at least partially enclosed by the at least partially light transmitting envelope.
7. The method according to claim 1 , wherein the substrate further has a second side, wherein the through-hole is provided in the substrate so as to extend from the first side of the substrate to the second side of the substrate.
8. The method according to claim 3 , wherein the through-hole is provided in the thermally conductive element.
9. A device comprising:
a substrate having a first side provided with a light source;
an at least partially light transmitting cover sealingly coupled to the substrate such that a chamber is defined by at least the first side of the substrate and the cover;
a luminescent material in the chamber;
a through-hole into the chamber, the through-hole being arranged to permit introduction of the luminescent material into the chamber, before the through-hole is sealed; and
a sealing material that is different from the luminescent material, the sealing material being disposed in the though-hole to seal the through-hole and protect the luminescent material from an environment of the device.
10. The device according to claim 9 , wherein the luminescent material is provided in a layer on at least a portion of an inner surface of the at least partially light transmitting cover.
11. The illumination device according to claim 10 , wherein a phosphor layer is provided on the at least partially light transmitting cover.
12. The illumination device according to claim 10 , wherein at least one of the layers comprising the luminescent material and the phosphor layer is arranged such that the illumination device emits light of different colors via different regions of the at least partially light transmitting cover.
13. The illumination device according to claim 11 , wherein the phosphor layer is provided on an outer surface of the at least partially light transmitting cover.
14. The method according to claim 1 , further comprising after introducing a luminescent material into the chamber and before sealing the through-hole, filling the chamber via the through-hole with a filling material that is different from the luminescent material.
15. The method according to claim 14 , wherein the filling material is selected from the group consisting of inert gas, nitrogen, a noble gas, silicone, a getter material, and calcium.
16. The device of claim 9 further comprising a filling material that is different from the luminescent material disposed between the luminescent material and the through-hole.
17. The device of claim 16 , wherein the filling material is selected from the group consisting of inert gas, nitrogen, a noble gas, silicone, a getter material, and calcium.
18. The device of claim 9 further comprising a vacuum disposed in the chamber between the luminescent material and the through-hole.
19. The method according to claim 1 , wherein the luminescent material includes structures that are sensitive to environmental conditions, and sealing the through-hole protects the luminescent material from exposure to the environmental conditions.
20. The method according to claim 19 , wherein the structures comprise quantum confinement structures.
21. The method according to claim 2 , wherein introducing the luminescent material comprises applying the luminescent material in a liquid phase such that the luminescent material in the liquid phase diffuses along the capillary grooves on the inner surface of the at least partially light transmitting cover.
22. The method according to claim 1 , wherein the luminescent material is selected from a group consisting of CaS 1-x ,Se x :Eu, MgS, and quantum confinement structures that are vulnerable to damage caused by environmental conditions.
23. The method according to claim 1 , further comprising providing a phosphor layer on an outer surface of the cover, the phosphor layer being less sensitive to the environment than is the luminescent material on the inner surface of the cover.
24. The device according to claim 9 , wherein the luminescent material includes structures that are sensitive to environmental conditions, and the sealing material in the through-hole protects the luminescent material from exposure to the environmental conditions.