Member bonding apparatus

1. A member bonding apparatus, comprising:

a member alignment preprocessing device for adjusting to align one member of two members to be bonded with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond;

a member alignment device for adjusting to align one member of the two members with another member in X, Y, Z-axis directions and α, β, θ-axis directions in accordance with images of the two members captured by a mounted CCD camera so that positions of the bonding surfaces of the two members correspond;

a member bonding device for making the bonding surfaces of the two members aligned by the member alignment device be bonded to each other through an adhesive, the adhesive being applied to the bonding surface of one of the two members; and

an adhesive curing preprocessing device for irradiating an edge of the bonded member, bonded with the member bonding device, with ultraviolet light through a mask and curing the adhesive at the edge of the bonded member,

wherein the adhesive curing preprocessing device includes the mask and an ultraviolet light source for generating the ultraviolet light, and the mask is shaped in rectangle to cover over all of the bonded member except the edge of the bonded member.

2. A member bonding apparatus, comprising:

a thickness measuring device for measuring thicknesses of two members to be bonded;

a member alignment preprocessing device for adjusting to align one member of the two members measured by the thickness measuring device with another member in X, Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond;

a member alignment device for adjusting to align one member of the two members with another member in X, Y, Z-axis directions and α, β, θ-axis directions in accordance with images of the two members captured by a mounted CCD camera so that the positions of the bonding surfaces of the two members correspond;

a thickness adjusting device for adjusting a thickness of a bonded member in accordance with the thicknesses of the two members measured by the thickness measuring device so that a thickness of an adhesive in the bonded member, the adhesive being applied to the bonding surface of one of the two members, the bonded member being formed when two members aligned by the member alignment device are bonded, achieves a predetermined thickness;

a member bonding device for making the bonding surfaces of the two members be bonded through the adhesive so that the bonded member has a thickness adjusted by the thickness adjusting device; and

an adhesive curing preprocessing device for irradiating an edge of the bonded member, bonded with the member bonding device, with ultraviolet light through a mask and curing the adhesive at the edge of the bonded member,

wherein the adhesive curing preprocessing device includes the mask and an ultraviolet light source for generating the ultraviolet light, and the mask is shaped in rectangle to cover over all of the bonded member except the edge of the bonded member.

3. A member bonding apparatus, comprising:

a thickness measuring device for measuring thicknesses of two members to be bonded;

a member alignment preprocessing device for adjusting to align one member of the two members measured by the thickness measuring device with another member in X, Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond;

a member alignment device for adjusting to align one member of the two members with another member in X, Y, Z-axis directions and α, β, θ-axis directions in accordance with images of the two members captured by a mounted CCD camera so that the positions of the bonding surfaces of the two members correspond;

a thickness adjusting device for adjusting a thickness of a bonded member in accordance with the thicknesses of the two members measured by the thickness measuring device so that a thickness of an adhesive in the bonded member, the adhesive being applied to the bonding surface of one of the two members, the bonded member being formed when the two members aligned by the member alignment device are bonded, achieves a predetermined thickness;

a member tilt adjusting device for determining tilts of the members, adjusting the members in α, β, θ-axis directions, and adjusting the tilts of the two members so that the members are kept level, in accordance with the thicknesses of the members measured by the thickness measuring device at plural points;

a member bonding device for making the bonding surfaces of the two members be bonded through the adhesive so that the bonded member has the thickness adjusted by the thickness adjusting device at tilt positions of the member adjusted by the member tilt adjusting device; and

an adhesive curing preprocessing device for irradiating an edge of the bonded member, bonded with the member bonding device, with ultraviolet light through a mask and curing the adhesive at the edge of the bonded member,

wherein the adhesive curing preprocessing device includes the mask and an ultraviolet light source for generating the ultraviolet light, and the mask is shaped in rectangle to cover over all of the bonded member except the edge of the bonded member.