Circuit on a thin carrier for use in hollow conductors and a manufacturing method

1. A method for manufacturing a substrate-based circuit with a carrier substrate for being attached within a hollow conductor and with at least one conductor line and/or at least one antenna element arranged respectively on the carrier substrate, the method comprising:

applying, by deposition, at least one fastening element to an outer region of the carrier substrate, the at least one fastening element projecting beyond the outer region of the carrier substrate; and

attaching the carrier substrate to and within the hollow conductor.

2. The method according to claim 1 , further including:

applying the carrier substrate to at least one sacrificial carrier;

applying a bond layer to the carrier substrate;

applying, to the bond layer, a contact layer from which the at least one conductor line and/or the at least one antenna element is formed; and

structuring the at least one conductor line and/or the at least one antenna element.

3. The method according to claim 2 , wherein the applying the carrier substrate includes:

applying a second sacrificial carrier to a first sacrificial carrier; and/or

applying the carrier substrate to the second sacrificial carrier.

4. The method according to claim 2 , wherein the structuring includes:

removing the contact layer except for a part on which the at least one conductor line and/or the at least one antenna element is formed, or a part which is embodied as a support surface for at least one electrical component;

removing the bond layer except for a first part which is disposed beneath the part of the contact layer on which the at least one conductor line and/or the at least one antenna element is formed; and/or

removing the bond layer except for at least one second part which provides a defined distance from the support surface on the contact layer which is embodied for the support of the at least one electrical component.

5. The method according to claim 4 , wherein the structuring further includes:

coating the carrier substrate together with the at least one second part of the bond layer and the contact layer with a solder-stop layer; and

removing the solder-stop layer except for regions which are disposed at least partially on the at least one second part of the bond layer and/or which are disposed in a region between the at least one second part of the bond layer and the support surface and/or which are disposed at least partially on the support surface.

6. The method according to claim 2 , wherein the applying by deposition includes:

removing an edge of the carrier substrate, thereby exposing a portion of the at least one sacrificial carrier;

coating the exposed portion of the at least one sacrificial carrier and the carrier substrate having the bond layer and the contact layer thereon with a further bond layer and with a further contact layer;

removing the further bond layer and the further contact layer from regions on the carrier substrate on which no fastening elements for stabilization are to be embodied; and

removing the further bond layer and the further contact layer from regions on the at least one sacrificial carrier on which no fastening elements are to be embodied except for an edging which surrounds the at least one fastening element at a defined distance and connects the at least one fastenings element via at least one web.

7. The method according to claim 6 , further including:

removing the at least one sacrificial carrier; and

removing a portion of the further bond layer that was coated on the at least one sacrificial carrier.

8. The method according to claim 7 , further including:

removing the edging by cutting with a laser through the at least one web of the at least one fastening element.

9. The method according to claim 5 , further including:

coating at least one region of the bond layer with the contact layer before the contact layer is coated with the solder-stop layer and/or a further bond layer; and

coating at least parts of the solder-stop layer or of the further bond layer which are arranged above the at least one region of the bond layer with a further contact layer, thereby forming a capacitor,

wherein a capacitance of the capacitor is adjusted via a variance of a thickness of the solder-stop layer and/or of the further bond layer and/or a size of the at least one region of the bond layer.

10. The method according to claim 3 , wherein:

the first sacrificial carrier contains Si; and/or

the second sacrificial carrier contains SiO 2 ; and/or

the bond layer contains Ti, TiW, and/or Cr; and/or

the carrier substrate comprises Si 3 N 4 and/or diamond; and/or

the contact layer contains Au.

11. A substrate-based circuit comprising:

a hollow conductor;

a carrier substrate attached within the hollow conductor;

a bond layer embodied on at least one part of the carrier substrate;

a contact layer embodied on at least one first part of the bond layer that forms at least one conductor line and/or at least one antenna element; and

at least one fastening element deposited at an outer region of the carrier substrate, the at least one fastening element projecting beyond the outer region of the carrier substrate.

12. The substrate-based circuit according to claim 11 , wherein:

the at least one fastening element is formed of a same material as a material of the contact layer; and/or

in the outer region in which the at least one fastening element is connected to the carrier substrate, another bond layer is arranged between the at least one fastening element and the carrier substrate.

13. The substrate-based circuit according to claim 11 , wherein:

the contact layer is embodied as a support surface for support of an electronic component; and/or

a second part of the bond layer is embodied at a defined distance from the support surface; and/or

at least part of the second part of the bond layer and/or a region between the second part of the bond layer and the support surface and/or at least a part of the support surface is provided with a solder-stop layer.

14. The substrate-based circuit according to claim 13 , wherein:

the contact layer is located on an area between the bond layer and the solder-stop layer;

a further contact layer is located on a further area, of identical size as the contact layer, on the solder-stop layer or on the solder-stop layer and the bond layer;

the further contact layer is connected in an electrically conducting manner to the at least one fastening element; and

the contact layer is connected in an electrically conducting manner to the at least one conductor line and/or to the at least one antenna element, thereby forming a capacitor.

15. The substrate-based circuit according to claim 13 , wherein:

the bond layer contains Ti, TiW, or Cr; and/or

the carrier substrate is made from Si 3 N 4 and/or diamond; and/or

the solder-stop layer is made from Si 3 N 4 ; and/or

the contact layer contains Au.

16. A hollow conductor comprising:

two hollow-conductor segments rigidly connected to one another, each hollow-conductor segment including a groove; and

a substrate-based circuit including:

a carrier substrate,

a bond layer embodied on at least one part of the carrier substrate,

a contact layer embodied on at least one first part of the bond layer that forms at least one conductor line and/or at least one antenna element, and

at least one fastening element deposited at an outer region of the carrier substrate, the at least one fastening element projecting beyond the outer region of the carrier substrate, and the at least one fastening element being clamped between the two hollow-conductor segments such that the substrate-based circuit is arranged centrally within a space in the hollow conductor formed by the respective grooves.

17. The hollow conductor according to claim 16 , wherein at least one hollow-conductor segment provides at least one recess that is arranged perpendicular to the at least one antenna element such that a microwave signal can be supplied to the at least one antenna element.