IP Library Granted Patent US 9,556,535
Granted Patent B2
US 9,556,535 · App. 14/765,884 · Granted Jan 31, 2017

Template for epitaxial growth, method for producing the same, and nitride semiconductor device

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Quick Facts
Patent No.
US 9,556,535
App. No.
14/765,884
Granted
Jan 31, 2017
Kind
B2
Abstract

The present invention provides a method for producing a template for epitaxial growth, the method including: a surface treatment step of dispersing Ga atoms on a surface of a sapphire substrate; and an AlN growth step of epitaxially growing an AlN layer on the sapphire substrate, wherein in a Ga concentration distribution in a depth direction perpendicular to the surface of the sapphire substrate in an internal region of the AlN layer excluding a near-surface region up to a depth of 100 nm from the surface of the AlN layer, which is obtained by secondary ion mass spectrometry, a position in the depth direction where the Ga concentration takes the maximum value is present in a near-interface region located between the interface of the sapphire substrate and a position at 400 nm spaced apart from the interface to the AlN layer side, and the maximum value of the Ga concentration is 3×10 17 atoms/cm 3 or more and 2×10 20 atoms/cm 3 or less.

Claims (26)

1. A method for producing a template having an AlN layer on a surface of a sapphire substrate and used as an underlayer for epitaxially growing a GaN-family compound semiconductor layer, the method comprising:

a surface treatment step of dispersing Ga atoms on a surface of a sapphire substrate; and

an AlN growth step of epitaxially growing an AlN layer on the sapphire substrate,

wherein in a Ga concentration distribution in a depth direction perpendicular to the surface of the sapphire substrate in an internal region of the AlN layer excluding a near-surface region up to a depth of 100 nm from the surface of the AlN layer, which is obtained by secondary ion mass spectrometry,

a position in the depth direction where the Ga concentration takes a maximum value is present in a near-interface region located between the surface of the sapphire substrate and a position at 400 nm spaced apart from the surface of the sapphire substrate to the AlN layer side, and

the maximum value of the Ga concentration is 3×10 17 atoms/cm 3 or more and 2×10 20 atoms/cm 3 or less.

2. The method for producing a template according to claim 1 , wherein a primary ion species used in the secondary ion mass spectrometry is O 2 + .

3. The method for producing a template according to claim 1 , wherein the AlN growth step is started at any of the following timings: after a completion of the surface treatment step, simultaneously with a start of the surface treatment step, or in a middle of the surface treatment step.

4. The method for producing a template according to claim 3 , wherein a primary ion species used in the secondary ion mass spectrometry is O 2 + .

5. The method for producing a template according to claim 1 , wherein in the surface treatment step, a compound as a material of Ga is supplied to a growth chamber for performing the AlN growth step.

6. The method for producing a template according to claim 5 , wherein a primary ion species used in the secondary ion mass spectrometry is O 2 + .

7. The method for producing a template according to claim 5 , wherein the AlN growth step is started at any of the following timings: after a completion of the surface treatment step, simultaneously with a start of the surface treatment step, or in a middle of the surface treatment step.

8. The method for producing a template according to claim 7 , wherein a primary ion species used in the secondary ion mass spectrometry is O 2 +.

9. A template for epitaxial growth comprising:

a sapphire substrate having Ga atoms dispersed on a surface thereof; and

an AlN layer epitaxially grown on the sapphire substrate,

wherein in a Ga concentration distribution in a depth direction perpendicular to the surface of the sapphire substrate in an internal region of the AlN layer excluding a near-surface region up to a depth of 100 nm from the surface of the AlN layer, which is obtained by secondary ion mass spectrometry,

a position in the depth direction where the Ga concentration takes a maximum value is present in a near-interface region located between the surface of the sapphire substrate and a position at 400 nm spaced apart from the surface of the sapphire substrate to the AlN layer side, and

the maximum value of the Ga concentration is 3×10 17 atoms/cm 3 or more and 2×10 20 atoms/cm 3 or less.

10. A nitride semiconductor device comprising:

the template for epitaxial growth according to claim 9 ; and

at least one GaN-family compound semiconductor layer epitaxially grown on the template.

11. The template for epitaxial growth according to claim 9 , wherein a primary ion species used in the secondary ion mass spectrometry is O 2 + .

12. A nitride semiconductor device comprising:

the template for epitaxial growth according to claim 11 ; and

at least one GaN-family compound semiconductor layer epitaxially grown on the template.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2023
From: SOKO KAGAKU CO., LTD.
To: NIKKISO CO., LTD.
Reel/Frame 063007/0395 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2015
From: PERNOT, CYRIL; HIRANO, AKIRA
To: SOKO KAGAKU CO., LTD.
Reel/Frame 036254/0684 →