Monolithic semiconductor chip array
View Patent ↗A semiconductor chip ( 10 ) is provided which comprises: a semiconductor layer sequence ( 20 ) with a p-type semiconductor region ( 5 ) and an n-type semiconductor region ( 3 ), a plurality of p-contacts ( 11 a, 11 b ), which are connected electrically conductively with the p-type semiconductor region ( 5 ), and a plurality of n-contacts ( 12 a, 12 b ), which are connected electrically conductively with the n-type semiconductor region ( 3 ), wherein: the p-contacts ( 11 a, 11 b ) and the n-contacts ( 12 a, 12 b ) are arranged on a rear side of the semiconductor chip ( 10 ), the semiconductor chip ( 10 ) comprises a plurality of regions ( 21, 22 ) arranged adjacent one another, and the regions ( 21, 22 ) each comprise one of the p-contacts ( 11 a, 11 b ) and one of the n-contacts ( 12 a, 12 b ).
1. An optoelectronic semiconductor chip, comprising:
a semiconductor layer sequence with a p-type semiconductor region and an n-type semiconductor region;
a plurality of p-contacts, which are connected electrically conductively with the p-type semiconductor region; and
a plurality of n-contacts, which are connected electrically conductively with the n-type semiconductor region,
wherein the p-contacts and the n-contacts are arranged on a rear side of the optoelectronic semiconductor chip,
wherein the optoelectronic semiconductor chip comprises a plurality of regions arranged adjacent one another,
wherein the regions each comprise one of the p-contacts and one of the n-contacts,
wherein a mirror layer is arranged on a side of the semiconductor layer sequence remote from a radiation exit face,
wherein a current spreading layer is arranged between the mirror layer and the n-contacts, which current spreading layer is electrically conductively connected with the n-contacts, and
wherein the current spreading layer is insulated from the mirror layer by means of a first electrically insulating layer and from the p-contacts by means of a second electrically insulating layer.
2. The optoelectronic semiconductor chip according to claim 1 , wherein the plurality of regions are similar in structure.
3. The optoelectronic semiconductor chip according to claim 1 , wherein the plurality of regions comprise a grid arrangement.
4. The optoelectronic semiconductor chip according to claim 1 , wherein trenches are arranged between the plurality of regions, which trenches divide the semiconductor layer sequence.
5. The optoelectronic semiconductor chip according to claim 1 , wherein at least two of the regions are connected in series.
6. The optoelectronic semiconductor chip according to claim 5 , wherein all the regions of the semiconductor chip are connected in series.
7. The optoelectronic semiconductor chip according to claim 1 , wherein at least two of the regions are connected in parallel.
8. The optoelectronic semiconductor chip according to claim 7 , wherein all the regions of the optoelectronic semiconductor chip are connected in parallel.
9. The optoelectronic semiconductor chip according to claim 7 , wherein the optoelectronic semiconductor chip comprises a carrier, and the at least two regions are connected in parallel by means of contact surfaces or conductor tracks arranged on the carrier.
10. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor layer sequence comprises a growth substrate, and the plurality of regions arranged adjacent one another are joined together by the growth substrate.
11. The optoelectronic semiconductor chip according to claim 1 , wherein a radiation-emitting active layer is arranged between the n-type semiconductor region and the p-type semiconductor region, wherein a radiation exit face is opposite the rear side of the semiconductor chip.
12. The optoelectronic semiconductor chip according to claim 1 , wherein the n-contacts are in each case electrically connected with the n-type semiconductor region by means of a plurality of through-vias, which each pass from the current spreading layer through the mirror layer and the semiconductor layer sequence.
13. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor chip is surface-mountable and the p-contacts and the n-contacts are arranged flush relative to one another.
14. The optoelectronic semiconductor chip according to claim 5 , wherein the optoelectronic semiconductor chip comprises a carrier, and the at least two regions are connected in series by means of contact surfaces or conductor tracks arranged on the carrier.
15. An optoelectronic semiconductor chip, comprising:
a semiconductor layer sequence with a p-type semiconductor region and an n-type semiconductor region;
a plurality of p-contacts, which are connected electrically conductively with the p-type semiconductor region; and
a plurality of n-contacts, which are connected electrically conductively with the n-type semiconductor region,
wherein the optoelectronic semiconductor chip comprises a plurality of regions arranged adjacent one another,
wherein the regions each comprise one of the p-contacts and one of the n-contacts,
wherein a mirror layer is arranged on a side of the semiconductor layer sequence remote from a radiation exit face,
wherein a current spreading layer is arranged between the mirror layer and the n-contacts, which current spreading layer is electrically conductively connected with the n-contacts,
wherein the current spreading layer is insulated from the mirror layer by means of a first electrically insulating layer and from the p-contacts by means of a second electrically insulating layer, and
wherein the n-contacts are in each case electrically connected with the n-type semiconductor region by means of a plurality of through-vias, which each pass from the current spreading layer through the mirror layer and the semiconductor layer sequence.
16. The optoelectronic semiconductor chip according to claim 15 , wherein the plurality of regions are similar in structure.
17. The optoelectronic semiconductor chip according to claim 15 , wherein the plurality of regions comprise a grid arrangement.