Optoelectronic semiconductor component and method for producing same
View Patent ↗An optoelectronic semiconductor component includes an optoelectronic semiconductor chip with a first surface and a second surface. The component also includes a protective chip which has a protective diode, a first surface and a second surface. The semiconductor chip and the protective chip are embedded in a molded body. A first electrical contact and a second electrical contact are arranged on the first surface of the semiconductor chip. A third electrical contact and a fourth electrical contact are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.
1. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip comprising a first surface and a second surface, wherein a first electrical contact and a second electrical contact are arranged at the first surface of the optoelectronic semiconductor chip;
a protective chip comprising a protective diode and having a first surface and a second surface, wherein a third electrical contact and a fourth electrical contact are arranged at the first surface of the protective chip, the third electrical contact being electrically conductively connected to the first electrical contact and the fourth electrical contact being electrically conductively connected to the second electrical contact; and
a molded body, wherein the optoelectronic semiconductor chip and the protective chip are embedded into the molded body,
wherein the first surface of the optoelectronic semiconductor chip and the first surface of the protective chip are not covered by the molded body,
wherein the second surface of the optoelectronic semiconductor chip and the second surface of the protective chip are not covered by the molded body,
wherein the first surface of the optoelectronic semiconductor chip, the first surface of the protective chip and a top side of the molded body jointly form a top side of the optoelectronic semiconductor component,
wherein the second surface of the optoelectronic semiconductor chip, the second surface of the protective chip and an underside of the molded body jointly form an underside of the optoelectronic semiconductor component,
wherein a first electrical contact area and a second electrical contact area are arranged at the underside of the optoelectronic semiconductor component,
wherein the optoelectronic semiconductor chip and the protective chip are electrically connected to the first electrical contact area and the second electrical contact area, and
wherein the second electrical contact area is arranged at the second surface of the protective chip.
2. The optoelectronic semiconductor component as claimed in claim 1 , wherein the optoelectronic semiconductor chip comprises a light emitting diode that is electrically connected antiparallel with the protective diode.
3. The optoelectronic semiconductor component as claimed in claim 1 , wherein the optoelectronic semiconductor component is embodied as a surface-mountable component.
4. The optoelectronic semiconductor component as claimed in claim 1 , wherein the protective chip has an electrically conductive connection between the second electrical contact area and the fourth electrical contact.
5. The optoelectronic semiconductor component as claimed in claim 1 , wherein the first electrical contact area is arranged at the second surface of the protective chip.
6. The optoelectronic semiconductor component as claimed in claim 5 , wherein the protective chip has an electrically conductive connection between the first electrical contact area and the third electrical contact.
7. The optoelectronic semiconductor component as claimed in claim 5 , wherein a thermally conductive contact area is arranged at the second surface of the optoelectronic semiconductor chip.
8. The optoelectronic semiconductor component as claimed in claim 1 , wherein the first electrical contact area is arranged at the second surface of the optoelectronic semiconductor chip.
9. The optoelectronic semiconductor component as claimed in claim 8 , wherein the optoelectronic semiconductor chip has an electrically conductive connection between the first electrical contact area and the first electrical contact.
10. The optoelectronic semiconductor component as claimed in claim 1 , wherein the first electrical contact and the third electrical contact are electrically connected through a bond connection.
11. The optoelectronic semiconductor component as claimed in claim 1 , wherein the first electrical contact and the third electrical contact are electrically connected through a planar connection.
12. The optoelectronic semiconductor component as claimed in claim 1 , wherein the first surface of the optoelectronic semiconductor chip is a radiation emission face of the optoelectronic semiconductor chip.
13. The optoelectronic semiconductor component as claimed in claim 1 , wherein the optoelectronic semiconductor chip is a light emitting device (LED) chip.
14. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip comprising a light emitting diode with an anode and a cathode;
a protective chip comprising a protective diode with an anode and a cathode; and
a molded body embedding the optoelectronic semiconductor chip and the protective chip such that a first surface of the optoelectronic semiconductor chip and a first surface of the protective chip are not covered by the molded body and a second surface of the optoelectronic semiconductor chip and a second surface of the protective chip are not covered by the molded body;
a first electrical connection of the first surface of the optoelectronic semiconductor chip and the first surface of the protective chip, the first electrical connection electrically connecting the anode of the light emitting diode to the cathode of the protective diode; and
a second electrical connection of the first surface of the optoelectronic semiconductor chip and the first surface of the protective chip, the second electrical connection electrically connecting the cathode of the light emitting diode to the anode of the protective diode,
wherein the first surface of the optoelectronic semiconductor chip, the first surface of the protective chip and a top side of the molded body jointly form a top side of the optoelectronic semiconductor component,
wherein the second surface of the optoelectronic semiconductor chip, the second surface of the protective chip and an underside of the molded body jointly form an underside of the optoelectronic semiconductor component,
wherein a first electrical contact area and a second electrical contact area are arranged at the underside of the optoelectronic semiconductor component,
wherein the optoelectronic semiconductor chip and the protective chip are electrically connected to the first electrical contact area and the second electrical contact area, and
wherein the second electrical contact area is arranged at the second surface of the protective chip.