Electrical Component Suitable For Miniaturization with Reduced Coupling
An electrical component includes a functional structure and a circuit element. In some embodiments, a chip is arranged between the functional structure and the circuit element thereby increasing the isolation between the functional structure and the circuit element. In some embodiments, the functional structure is arranged between the chip and a cover.
1 - 11 . (canceled)
12 . An electrical component, comprising:
an electrical circuit having a functional structure and a circuit element; and
a chip arranged between the functional structure and the circuit element, the chip increasing isolation between the functional structure and the circuit element.
13 . The electrical component according to claim 12 , further comprising a cover, wherein the functional structure is arranged between the chip and the cover.
14 . The electrical component according to claim 13 , wherein the cover comprises a thin-film cover, a WLP (wafer level package) cover, a lid chip, a plastic cap, or a metal cap.
15 . The electrical component according to claim 14 , wherein the cover has a plurality of layers and a planar top side.
16 . The electrical component according to claim 14 , wherein the cover has a single layer and a planar top side.
17 . The electrical component according to claim 12 , wherein the functional structure comprises a SAW structure, a BAW structure, a GBAW structure, or a MEMS structure.
18 . The electrical component according to claim 12 , wherein the circuit element comprises an inductive element, a capacitive element, or a resistive element.
19 . The electrical component according to claim 12 , wherein
the electrical circuit comprises a plated-through hole through the chip; and
the functional structure is electrically connected to the circuit element via the plated-through hole.
20 . The electrical component according to claim 12 , wherein the electrical circuit further comprises a direct interconnection between the functional structure and the circuit element.
21 . The electrical component according to claim 20 , further comprising a substrate connected to the chip by a bump connection, the substrate electrically connected to the interconnection.
22 . The electrical component according to claim 21 , wherein the substrate comprises a carrier substrate having a plurality of insulating layers composed of an insulating material and also comprises impedance elements structured in metallization planes between the insulating layers.
23 . The electrical component according to claim 20 , wherein the interconnection is at least one part of an RF circuit.
24 . An electrical component, comprising:
a chip including a plated-through hole extending from a first main surface to an opposite second main surface of the chip, wherein the plated through-hole is part of an RF circuit;
a functional structure disposed on the first main surface of the chip, the functional structure comprising a SAW structure, a BAW structure, a GBAW structure, or a MEMS structure; and
a circuit element disposed on the second main surface of the chip and electrically connected to the functional structure by the plated-through hole, wherein the circuit element comprises an inductive element, a capacitive element, or a resistive element.
25 . The electrical component according to claim 24 , wherein the presence of the chip between the functional structure and the circuit element increases isolation between the functional structure and the circuit element.
26 . The electrical component according to claim 24 , further comprising a cover overlying the functional structure so that the functional structure is arranged between the chip and the cover.
27 . The electrical component according to claim 26 , wherein the cover comprises a thin-film cover, a wafer level package cover, a lid chip, a plastic cap, or a metal cap.
28 . The electrical component according to claim 24 , further comprising a substrate connected to the chip by a bump connection and electrically connected to the plated through-hole.
29 . The electrical component according to claim 28 , wherein the substrate comprises a carrier substrate having a plurality of insulating layers composed of an insulating material and also comprises impedance elements structured in metallization planes between the insulating layers.