Optoelectronic semiconductor chip and optoelectronic semiconductor component

1. An optoelectronic semiconductor component comprising:

an optoelectronic semiconductor chip; and

a conversion element arranged at a radiation exit surface of the optoelectronic semiconductor chip,

wherein the conversion element is rectangular,

wherein the conversion element completely covers the radiation exit surface,

wherein the optoelectronic semiconductor chip comprises a non-rectangular, parallelogram-shaped top surface and an active zone, which is at a distance from the top surface and runs parallel to the top surface at least in places,

wherein the top surface comprises the radiation exit surface, through which electromagnetic radiation generated during operation in the active zone emerges,

wherein the radiation exit surface has at least four vertices,

wherein the top surface comprises at least one triangular connection area via which the active zone is electrically connectable,

wherein the at least one triangular connection area directly adjoins the radiation exit surface, and wherein the at least one triangular connection area directly adjoins a rim of the optoelectronic semiconductor chip.

2. The optoelectronic semiconductor component according to claim 1 , wherein the conversion element comprises a rectangular lamella or a rectangular foil.

3. An optoelectronic semiconductor chip comprising:

a non-rectangular, parallelogram-shaped top surface; and

an active zone, which is at a distance from the top surface and runs parallel to the top surface at least in places,

wherein the top surface comprises a radiation exit surface, through which electromagnetic radiation generated during operation in the active zone emerges,

wherein the radiation exit surface has at least four vertices,

wherein the top surface comprises a triangular connection area via which the active zone is electrically connectable,

wherein the triangular connection area directly adjoins the radiation exit surface, and wherein the triangular connection area directly adjoins a rim of the optoelectronic semiconductor chip.

4. The optoelectronic semiconductor chip according to claim 3 , wherein the top surface comprises exactly one radiation exit surface and exactly two triangular connection areas, that are arranged at mutually opposite sides of the top surface, wherein the radiation exit surface is arranged between the two triangular connection areas.

5. The optoelectronic semiconductor chip according to claim 3 , wherein the radiation exit surface is rectangular.

6. The optoelectronic semiconductor chip according to claim 3 , wherein the radiation exit surface has six vertices.

7. The optoelectronic semiconductor chip according to claim 3 , wherein the optoelectronic semiconductor chip comprises a plated-through hole that penetrates through the active zone, wherein the plated-through hole is electrically conductively connected to the triangular connection area.

8. The optoelectronic semiconductor chip according to claim 3 , wherein the top surface exclusively comprises the radiation exit surface and the triangular connection area or a plurality of triangular connection areas.

9. The optoelectronic semiconductor chip according to claim 3 , wherein the triangular connection area is wire-bondable.

10. An optoelectronic semiconductor component comprising:

the optoelectronic semiconductor chip according to claim 3 ; and

a conversion element arranged at the radiation exit surface of the optoelectronic semiconductor chip, wherein the conversion element is rectangular, and wherein the conversion element completely covers the radiation exit surface.

11. The optoelectronic semiconductor component according to claim 10 , wherein the conversion element projects beyond a side surface of the optoelectronic semiconductor chip in places.

12. The optoelectronic semiconductor component according to claim 10 , wherein the conversion element completely covers radiation exit surfaces of a plurality of optoelectronic semiconductor chips.

13. The optoelectronic semiconductor component according to claim 10 ,

wherein the optoelectronic semiconductor component comprises two optoelectronic semiconductor chips, each having exactly one triangular connection area,

wherein the two optoelectronic semiconductor chips adjoin one another at their side surfaces respectively facing away from the triangular connection areas, and

wherein the conversion element completely covers radiation exit surfaces of both optoelectronic semiconductor chips.

14. The optoelectronic semiconductor component according to claim 10 , wherein the electromagnetic radiation emerging through the radiation exit surface during operation is at least partly wavelength-converted by the conversion element.

15. The optoelectronic semiconductor component according to claim 10 , wherein the conversion element comprises a rectangular lamella or a rectangular foil.

16. An optoelectronic semiconductor chip comprising:

a non-rectangular, parallelogram-shaped top surface; and

an active zone, which is at a distance from the top surface and runs parallel to the top surface at least in places,

wherein the top surface comprises a radiation exit surface, through which electromagnetic radiation generated during operation in the active zone emerges,

wherein the radiation exit surface has at least four vertices,

wherein the top surface comprises exactly two triangular connection areas via which the active zone is electrically connectable,

wherein the top surface comprises exactly one radiation exit surface,

wherein the radiation exit surface and the two triangular connection areas are arranged at mutually opposite sides of the top surface,

wherein the radiation exit surface is arranged between the two triangular connection areas,

wherein the two triangular connection areas each directly adjoins the radiation exit surface, and wherein the two triangular connection areas each directly adjoins a rim of the optoelectronic semiconductor chip.