Production method of a sensor chip and computerized tomography detector
View Patent ↗A sensor chip, in particular for computerized tomography detectors, including an analog-digital converter electrically connected to an element detecting radiation. A problem addressed is that of defining a sensor chip which is as cost-efficient and reliable as possible. According to an embodiment of the invention, only one single crystalline base plate is used, on which all required components of the sensor chip are applied. A through-contact between the conductor paths or the contacts of both sides of the base plate is used as applicable in order to connect the components of both sides to each other.
1. A sensor chip, comprising:
an analog-digital-converter electrically connected to an element to detect radiation and a crystalline base plate, components of the element to detect radiation and components of the analog-digital-converter being lithographically integrated simultaneously via a single complementary metal-oxide semiconductor process on one detector side of the crystalline base plate.
2. The sensor chip of claim 1 , wherein the analog-digital-converter is electrically connected to an electrical connecting element on a second side of the crystalline base plate, opposite the detector side of the crystalline base plate, via a through-contact of the crystalline base plate.
3. The sensor chip of claim 2 , wherein the through-contact includes metal plating, provided for transmission of a digital signal from the detector side, through the crystalline base plate, to the second side of the crystalline base plate.
4. The sensor chip of claim 3 , wherein the through-contact is formed at least partially by a recess in the crystalline base plate.
5. The sensor chip of claim 4 , wherein the recess is an etched recess.
6. The sensor chip of claim 4 , wherein the electrical connecting element is applied on the second side of the crystalline base plate.
7. The sensor chip of claim 2 , wherein the crystalline base plate is permeable for the radiation detectable by the element to detect radiation and the electrical connecting element is applied on the detector side of the crystalline base plate.
8. The sensor chip of claim 2 , wherein the components of the element to detect radiation, the components of the analog-digital-converter and the components of the connecting element are electrical or electronic components.
9. The sensor chip of claim 1 , wherein the crystalline base plate is permeable for the radiation detectable by the element to detect radiation and the electrical connecting element is applied on the detector side of the crystalline base plate.
10. The sensor chip of claim 1 , wherein the components of the element to detect radiation, the components of the analog-digital-converter and the components of the connecting element are electrical or electronic components.
11. The sensor chip of claim 10 , wherein the components of the element to detect radiation, the components of the analog-digital-converter and the components of the connecting element are undoped and/or doped semiconductor layers.
12. The sensor chip of claim 1 , wherein the sensor chip is intended for flat arrangement with laterally adjacent sensor chips.
13. A computerized tomography detector comprising:
a multiplicity of the sensor chips of claim 12 .
14. The sensor chip of claim 12 , wherein the sensor chip is intended for structurally identical sensor chips.
15. The sensor chip of claim 1 , wherein the sensor chip is for a computerized tomography detector.
16. A computerized tomography detector comprising:
a multiplicity of the sensor chips of claim 1 .
17. A production method of a sensor chip, comprising:
lithographically integrating simultaneously via a single complementary metal-oxide semiconductor process components of an element to detect radiation and components of an analog-digital-converter on one detector side of a crystalline base plate;
insulating the detector side with the components of the element to detect radiation and the components of the analog-digital-converter;
designing a through-contact, for the electrically conductive connection of conductor paths of the detector side, with conductor paths of the second side of the crystalline base plate; and
insulating the second side of the crystalline base plate.
18. A method for the operation of a sensor chip, the method comprising:
detecting radiation on one detector side of a crystalline base plate of the sensor chip;
converting the detected radiation into an analog signal;
converting the analog signal into a digital signal by way of an analog-digital converter lithographically integrated simultaneously with components of the detector via a single complementary metal-oxide semiconductor process on the one detector side of the crystalline base plate; and
conducting the digital signal from the detector side, via a through-contact of the base plate, to a second side of the base plate.
19. The method as claimed in claim 18 , wherein the digital signal on the second side of the base plate is conducted by electrical or electronic components.
20. The method as claimed in claim 19 , wherein the digital signal on the second side of the base plate is conducted by components of a connecting element.