Electronic circuit component mounting system
An electronic circuit component mounting machine including a suction nozzle lowered by a first linear motor and a second linear motor by two stages A drive circuit of the second linear motor includes a reaction force detecting section and a damage detecting section that detects damage of an electronic circuit component. A controller that controls the drive circuit includes an appropriate operation parameter determining section that determines an appropriate value of an operation parameter of the second linear motor using the reaction force detecting section and the damage detecting section.
1. An electronic circuit component mounting system comprising:
a component supplying device that supplies an electronic circuit component;
a target member holding device that holds a mounting target member to which the electronic circuit component is to be mounted;
a mounting device that includes a component holding tool which holds the electronic circuit component and includes a lifting and lowering device which lifts and lowers the component holding tool, the mounting device receives the electronic circuit component from the component supplying device using the component holding tool, and mounts the electronic circuit component on the mounting target member held by the target member holding device; and
a damage detecting device that detects that the electronic circuit component is damaged in at least one of when the component holding tool contacts the electronic circuit component by the component holding tool being lowered by the lifting and lowering device, and when the electronic circuit component held by the component holding tool contacts the mounting target member by the component holding tool being lowered by the lifting and lowering device, the damage detection device including a reaction force detecting section that detects a reaction force against the component holding tool in at least one of when the component holding tool contacts the electronic circuit component, and when the electronic circuit component held by the component holding tool contacts the mounting target member,
wherein the reaction force detecting section includes a drive source current detecting section that detects a current of a drive source of the lifting and lowering device as an amount corresponding to the reaction force against the component holding tool.
2. The electronic circuit component mounting system according to claim 1 ,
wherein the damage detection device includes
a damage determining section that determines presence or absence of damage of the electronic circuit component based on a changed state of the reaction force detected by the reaction force detecting section.
3. The electronic circuit component mounting system according to claim 2 , wherein the reaction force detecting section includes a reaction force sensor that is disposed between a drive source of the lifting and lowering device and the component holding tool, and that detects the reaction force which is applied to the drive source from the component holding tool.
4. The electronic circuit component mounting system according to claim 2 , wherein the damage determining section includes a reaction-force-change-state-dependent determination section which determines that the electronic circuit component is damaged in a case in which a changed state of the reaction force detected by the reaction force detecting section is different from a set change state which is set in advance.
5. The electronic circuit component mounting system according to claim 1 , further comprising: a damage reporting section which reports that damage of the electronic circuit component has been detected by the damage detecting device, and
a mounting operation stopping section that, in a case in which damage of the electronic circuit component has been detected by the damage detecting device, stops a mounting operation of the electronic circuit component which is performed by the electronic circuit component mounting system.
6. The electronic circuit component mounting system according to claim 1 , further comprising: a damage reporting section which reports that damage of the electronic circuit component has been detected by the damage detecting device.
7. The electronic circuit component mounting system according to claim 1 , further comprising: a mounting operation stopping section that, in a case in which damage of the electronic circuit component has been detected by the damage detecting device, stops a mounting operation of the electronic circuit component which is performed by the electronic circuit component mounting system.
8. An electronic circuit component mounting system comprising:
a component supplying device that supplies an electronic circuit component;
a target member holding device that holds a mounting target member to which the electronic circuit component is to be mounted;
a mounting device that includes a component holding tool which holds the electronic circuit component and includes a lifting and lowering device which lifts and lowers the component holding tool, the mounting device receives the electronic circuit component from the component supplying device using the component holding tool, and mounts the electronic circuit component on the mounting target member held by the target member holding device; and
a damage detecting device that detects that the electronic circuit component is damaged in at least one of when the component holding tool contacts the electronic circuit component by the component holding tool being lowered by the lifting and lowering device, and when the electronic circuit component held by the component holding tool contacts the mounting target member by the component holding tool being lowered by the lifting and lowering device,
wherein the damage detection device includes
a reaction force detecting section that detects a reaction force against the component holding tool in at least one of when the component holding tool contacts the electronic circuit component, and when the electronic circuit component held by the component holding tool contacts the mounting target member; and
a damage determining section that determines presence or absence of damage of the electronic circuit component based on a changed state of the reaction force detected by the reaction force detecting section,
wherein the damage determining section includes a reaction-force-change-state-dependent determination section which determines that the electronic circuit component is damaged in a case in which a changed state of the reaction force detected by the reaction force detecting section is different from a set change state which is set in advance, and
wherein the reaction-force-change-state-dependent determination section includes a reaction-force-rapid-decrease-dependent determination section which determines that the electronic circuit component is damaged in a case in which the reaction force detected by the reaction force detecting section rapidly decreases by an amount equal to or more than a set amount during an increase of the reaction force.
9. An electronic circuit component mounting system comprising:
a component supplying device that supplies an electronic circuit component;
a target member holding device that holds a mounting target member to which the electronic circuit component is to be mounted;
a mounting device that includes a component holding tool which holds the electronic circuit component and includes a lifting and lowering device which lifts and lowers the component holding tool, the mounting device receives the electronic circuit component from the component supplying device using the component holding tool, and mounts the electronic circuit component on the mounting target member held by the target member holding device;
a damage detecting device that detects that the electronic circuit component is damaged in at least one of when the component holding tool contacts the electronic circuit component by the component holding tool being lowered by the lifting and lowering device, and when the electronic circuit component held by the component holding tool contacts the mounting target member by the component holding tool being lowered by the lifting and lowering device; and
a damage operation parameter acquiring section that acquires an operation parameter in a case in which damage of the electronic circuit component is detected by the damage detecting device when an operation of making the electronic circuit component held by the component holding tool contact the mounting target member held by the target member holding device is repeatedly performed while changing, in accordance with a predetermined rule, the operation parameter,
wherein the operation parameter is a parameter of the operation with respect to the target member holding device, the electronic circuit component, and the mounting target.
10. An electronic circuit component mounting system comprising:
a component supplying device that supplies an electronic circuit component;
a target member holding device that holds a mounting target member to which the electronic circuit component is to be mounted;
a mounting device that includes a component holding tool which holds the electronic circuit component and includes a lifting and lowering device which lifts and lowers the component holding tool, the mounting device receives the electronic circuit component from the component supplying device using the component holding tool, and mounts the electronic circuit component on the mounting target member held by the target member holding device;
a damage detecting device that detects that the electronic circuit component is damaged in at least one of when the component holding tool contacts the electronic circuit component by the component holding tool being lowered by the lifting and lowering device, and when the electronic circuit component held by the component holding tool contacts the mounting target member by the component holding tool being lowered by the lifting and lowering device; and
a damage operation parameter acquiring section that acquires an operation parameter in a case in which damage of the electronic circuit component is detected by the damage detecting device when an operation of making the component holding tool contact the electronic circuit component held by the component supplying device is repeatedly performed while changing, in accordance with a predetermined rule, the operation parameter,
wherein the operation parameter is a parameter of the operation with respect to the component supplying device and the electronic circuit component.