Apparatus and method for establishing an electrically conductive and mechanical connection

1. An apparatus comprising:

a main body having an electrode; and

a contact element that is a wire comprising a connection region that is directly mechanically and electrically conductively connected to the electrode in order to electrically conductively and mechanically connect the main body and the contact element so that an electrical and mechanical connection between the electrode and the contact element is free of melting regions of materials of the electrode and of the contact element that are involved in the connection, wherein the connection is realized in a manner free of solder material, wherein the contact element is flattened in a region in which the connection is formed, and wherein the contact element has a larger width in the connection region than in a region other than the connection region;

wherein the connection has a plurality of local connection regions delimited from one another between the electrode and the contact element;

wherein the connection region forms a continuous region where the local connection regions are arranged;

wherein each local connection region of the plurality of local connection regions comprises a cohesive diffusion connection of the materials of the electrode and a material of the contact element; and

wherein the cohesive diffusion connection is formed by application of mechanical force and heat.

2. The apparatus according to claim 1 , wherein the connection is realized in a manner free of any connection material.

3. The apparatus according to claim 1 , wherein the connection is formed by a cohesive diffusion connection between a material of the electrode and a material of the contact element.

4. The apparatus according to claim 1 , wherein a surface of the contact element that faces the electrode has a noble metal surface region in a connecting region in which the connection is formed.

5. An apparatus according to claim 1 , wherein the main body comprises a ceramic body or a semiconductor body.

6. The apparatus according to claim 5 , wherein the main body comprises an NTC ceramic.

7. The apparatus according to claim 1 , further comprising an encapsulation around the connection, wherein the encapsulation is arranged in such a way that it protects the connection from external forces.

8. A method for producing an electrically conductive and mechanical connection between a main body having an electrode and a contact element, wherein the contact element is a wire, the method comprising:

directly mechanically contacting the electrode and the contact element in a contact region; and

applying a mechanical force and heat to the contact region, such that the electrically conductive and mechanical connection between the electrode and the contact element is formed in the contact region, wherein the contact element is flattened in a region in which the connection is formed, and wherein the contact element has a larger width in the connection region than in a region other than the connection region;

wherein the connection has a plurality of local connection regions delimited from one another between the electrode and the contact element;

wherein the connection region forms a continuous region where the local connection regions are arranged;

wherein each local connection region of the plurality of local connection regions comprises a cohesive diffusion connection of an electrode material and a material of the contact element; and

wherein the cohesive diffusion connection is formed by application of mechanical force and heat.

9. The method according to claim 8 , wherein exclusively the mechanical force and heat are applied to the contact region to form the connection.

10. The method according to claim 8 , wherein a temperature of the heat and the mechanical force are chosen so that a diffusion of material takes place, and wherein the contact element is mechanically stably and electrically conductively connected to the electrode.

11. The method according to claim 8 , wherein a temperature of the heat is below a melting point of an electrode material.

12. The method according to claim 8 , wherein a temperature of the heat is below a melting point of a material of the contact element that is offered for the connection.

13. The method according to claim 8 , wherein the mechanical force is between 5 N and 10 N and the heat is applied at a temperature of between 350° C. and 550° C.

14. The method according to claim 8 , further comprising encapsulating the connection after the connection is formed.

15. The method according to claim 14 , wherein the connection is encapsulated with a shaped body for mechanically stabilizing the contact element.