SINTER PASTE WITH COATED SILVER OXIDE ON NOBLE AND NON-NOBLE SURFACES THAT ARE DIFFICULT TO SINTER
A mixture contains metal oxide particles that are coated with an organic compound. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.
1 .- 26 . (canceled)
27 . A mixture comprising:
a) metal oxide particles; and
b) an organic compound represented by Formula I:
R 1 —COR 2 (I),
wherein R 1 is an aliphatic residue having 8 to 32 carbon atoms, wherein R 2 is either —OM or comprises the moiety —X—R 3 , wherein X is selected from the group consisting of O, S, N—R 4 , wherein R 4 is a hydrogen atom or an aliphatic residue, wherein R 3 is a hydrogen atom or an aliphatic residue, and wherein M is a cation.
28 . The mixture according to claim 27 , where the metal oxide particles are fully or partly coated with the organic compound.
29 . The mixture according to claim 27 , wherein the organic compound is a C 8 -C 30 fatty acid or a derivative thereof.
30 . The mixture according to claim 27 , wherein the metal oxide particles are coated with the organic compound and wherein an average primary particle size of the coated metal oxide particles is between 0.1 and 3.0 μm.
31 . The mixture according to claim 27 , further comprising metal particles, the weight ratio of the metal particles to the metal oxide particles being at most 6 to 1.
32 . The mixture according to claim 31 , wherein a fraction of the metal particles is less than 30% by weight relative to a total weight of the mixture.
33 . The mixture according to claim 31 , wherein the metal particles are selected from the group consisting of copper, silver, and palladium.
34 . The mixture according to claim 33 , wherein the metal particles are silver and the metal oxide particles are silver oxide, or wherein the metal particles are copper and the metal oxide particles are copper oxide, or wherein the metal particles are palladium and the metal oxide particles are palladium oxide.
35 . The mixture according to claim 27 , wherein the metal oxide particles, are selected from the group consisting of copper oxide, silver oxide, and palladium oxide.
36 . The mixture according to claim 27 , wherein the mixture is a paste further comprising c) a dispersing agent.
37 . The mixture according to claim 37 , wherein the dispersing agent is selected from the group consisting of alpha-terpineol, beta-terpineol, gamma-terpineol, delta terpineol, N-methyl-2-pyrrolidone, ethylene glycol, dimethylacetamide, 1-tridecanol, 2-tridecanol, 3-tridecanol, 4-tridecanol, 5-tridecanol, 6-tridecanol, isotridecanol, dibasic esters, glycerol, diethylene glycol, triethylene glycol and mixture thereof.
38 . The mixture according to claim 27 , wherein a fraction of glass in the mixture is less than 2% by weight relative to a total weight of the mixture.
39 . The mixture according to claim 27 , wherein the metal oxide particles are silver oxide particles.
40 . The mixture according to claim 39 , wherein the silver oxide particles are present in an amount of 60% to 95% by weight relative to a total weight of the mixture.
41 . The mixture according to claim 27 , wherein the mixture is a polymer comprising oxygen atoms.
42 . A method for connecting a component having a first surface to a substrate having a second surface, the method comprising:
a) contacting the first surface of the component with the second surface of the substrate via by the mixture according to claim 27 , such that the mixture is situated between the first surface of the component and the second surface of the substrate, in order to obtain a structure; and
b) heating the structure.
43 . The method according to claim 42 , wherein at least one of the first and second surfaces contains at least one metal selected from the group consisting of copper, nickel, gold, aluminum, and silver.
44 . The method according to claim 43 , wherein a fraction of a volume formed by a product of the at least one of the first and second surfaces and a depth of 1 μm accounted for by the at least one metal is at least 50% by weight relative to a total weight of metals in the volume.
45 . The method according to claim 42 , wherein at least one of the first and second surfaces comprises one or more metals selected from the group consisting of nickel and aluminum.
46 . The method according to claim 42 , wherein at least one of the first and second surfaces is fully or partly covered, with a carbon-containing compound.
47 . The method according to claim 46 , wherein the carbon-containing compound is a polymer.
48 . The method according to claim 42 , wherein the mixture comprises 60% to 95% by weight of the metal oxide particles coated with the organic compound, and wherein the heating of the structure proceeds at a process pressure of 5 to 20 MPa.
49 . The method according to claim 42 , wherein the mixture further comprises 10% to 30% by weight of metal particles coated with organic compound, and wherein the heating of the structure proceeds at a process pressure of 0 MPa to 3 MPa.
50 . A module comprising:
i) an electronic component having a first surface,
ii) a substrate having a second surface, and
iii) the mixture according to claim 27 in direct contact with the first surface and the second surface.
51 . The module according to claim 50 , wherein the mixture is sintered.
52 . The module according to claim 50 , wherein at least one of the first and second surfaces is selected from the group consisting of copper, silver, gold, nickel, and aluminum.
53 . The module according to claim 50 , wherein at least one of the first and second surfaces is fully or partly covered with a carbon-containing compound.
54 . A method for producing the mixture according to claim 27 , the method comprising mixing the metal oxide particles with the organic compound