IP Library Granted Patent US 9,680,052
Granted Patent B2
US 9,680,052 · App. 14/785,461 · Granted Jun 13, 2017

Optoelectronic gan-based component having increased ESD resistance via a superlattice and method for the production thereof

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Quick Facts
Patent No.
US 9,680,052
App. No.
14/785,461
Granted
Jun 13, 2017
Kind
B2
Abstract

An optoelectronic component includes a semiconductor layer structure having a quantum film structure, and a p-doped layer arranged above the quantum film structure, wherein the p-doped layer includes at least one first partial layer and a second partial layer, and the second partial layer has a higher degree of doping than the first partial layer.

Claims (42)

1. An optoelectronic component comprising:

a semiconductor layer structure having a quantum film structure;

a p-doped layer arranged above the quantum film structure; and

a spacer layer arranged between the quantum film structure and the p-doped layer,

wherein the p-doped layer comprises at least one first partial layer and a second partial layer,

the second partial layer has a higher degree of doping than the first partial layer, and

a degree of doping in a growth direction of the semiconductor layer structure in the spacer layer is increased between a doping level of the quantum film structure and a doping level of the p-doped layer.

2. The optoelectronic component according to claim 1 , wherein the p-doped layer comprises a plurality of first partial layers and second partial layers which alternately succeed one another.

3. The optoelectronic component according to claim 1 , wherein the first partial layer has a degree of doping less than 5×10^18 per cubic centimeter.

4. The optoelectronic component according to claim 1 , wherein the second partial layer has a degree of doping of 1×10^18 per cubic centimeter to 1.5×10^20 per cubic centimeter.

5. The optoelectronic component according to claim 1 , wherein the first partial layer and the second partial layer each have a thickness of 1 nm to 50 nm.

6. The optoelectronic component according to claim 1 , wherein the p-doped layer comprises 1 to 50 first partial layers.

7. The optoelectronic component according to claim 1 , wherein two second partial layers have different degrees of doping.

8. The optoelectronic component according to claim 1 , wherein the spacer layer has a thickness of 2 nm to 120 nm.

9. The optoelectronic component according to claim 1 ,

wherein the spacer layer comprises a first partial spacer layer having a lower degree of doping and a second partial spacer layer having a higher degree of doping, and

the first partial spacer layer is arranged nearer to the quantum film structure than the second partial spacer layer.

10. The optoelectronic component according to claim 1 , wherein the p-doped layer is doped with magnesium, carbon or boron.

11. The optoelectronic component according to claim 1 ,

wherein the p-doped layer has an indium proportion of less than 30%, and

the p-doped layer has an aluminum proportion of less than 30%.

12. A method of producing an optoelectronic component comprising:

providing a substrate;

growing a quantum film structure;

growing a p-doped layer; and

growing a space layer between the quantum film structure and the p-doped layer, wherein

growing the p-doped layer comprises growing at least one first partial layer and a second partial layer,

the second partial layer has a higher degree of doping than the first partial layer, and

a degree of doping in a growth direction of the semiconductor layer structure in the spacer layer is increased between a doping level of the quantum film structure and a doping level of the p-doped layer.

13. The method according to claim 12 , wherein a plurality of first partial layers and second partial layers are grown alternately.

14. The method according to claim 12 , wherein a spacer layer is grown between the quantum film structure and the p-doped layer.

15. An optoelectronic component comprising:

a semiconductor layer structure having a quantum film structure;

a p-doped layer arranged above the quantum film structure; and

a spacer layer arranged between the quantum film structure and the p-doped layer, wherein

the p-doped layer comprises at least one first partial layer and a second partial layer,

the second partial layer has a higher degree of doping than the first partial layer,

a degree of doping in a growth direction of the semiconductor layer structure in the spacer layer is increased between a doping level of the quantum film structure and a doping level of the p-doped layer,

the p-doped layer comprises a plurality of first partial layers and second partial layers which alternately succeed one another,

the p-doped layer has an indium proportion of less than 30%, and

the p-doped layer has an aluminum proportion of less than 30%.

16. The optoelectronic component according to claim 15 , wherein the p-doped layer is free of indium and free of aluminum.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: LÖFFLER, ANDREAS; MEYER, TOBIAS; BAUER, ADAM; LEIRER, CHRISTIAN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 037665/0886 →