Organic light-emitting diode and manufacturing method therefor
Provided are an organic light emitting diode and a method for preparing the same.
1. An organic light emitting device, comprising:
a substrate;
an organic light emitting part in which a first electrode, an organic material layer, and a second electrode are sequentially laminated on the substrate; and
a sealing part covering an outside of the organic light emitting part of the substrate,
wherein the sealing part includes a printed circuit board including a base and a metal pattern formed at an edge of one side of the base, and a sealing layer filling a space between the printed circuit board and the outside of the organic emitting part,
wherein the base is formed directly on the sealing layer.
2. The organic light emitting device of claim 1 , wherein the printed circuit board includes one or more metal patterns.
3. The organic light emitting device of claim 2 , wherein the printed circuit board includes an insulating layer provided on at least one among a location between the base and the metal pattern, between two or more metal patterns, and on the metal pattern.
4. The organic light emitting device of claim 1 , wherein the printed circuit board is a flexible printed circuit board.
5. The organic light emitting device of claim 1 , wherein the first electrode or the second electrode is electrically connected with an external power source through the metal pattern.
6. The organic light emitting device of claim 5 , wherein the metal pattern includes a first metal pattern electrically connecting the first electrode and the external power source.
7. The organic light emitting device of claim 6 , wherein the metal pattern includes a second metal pattern electrically connecting the second electrode and the external power source.
8. The organic light emitting device of claim 1 , wherein a metal plate which is not connected with the metal pattern is included on one side of the base, and the metal plate is provided on a light emitting area of the organic light emitting part.
9. The organic light emitting device of claim 8 , wherein the metal plate is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.
10. The organic light emitting device of claim 8 , wherein the size of the metal plate corresponds to the size of the organic light emitting part, or is larger than the size of the organic light emitting part.
11. The organic light emitting device of claim 1 , wherein the metal pattern provided at the edge of one side of the base includes a first metal pattern and a second metal pattern, the first metal pattern electrically connects the first electrode and an external power source, the second metal pattern electrically connects the second electrode and the external power source, and the first metal pattern and the second metal pattern are spaced apart from each other to be electrically short-circuited.
12. The organic light emitting device of claim 1 , wherein the sealing part further includes an anisotropic conductive film which bonds the printed circuit board and the substrate to each other.
13. The organic light emitting device of claim 1 , wherein the organic light emitting device further includes an anisotropic conductive film provided at the edge of the one side of the base, and the sealing layer is provided in an area without the anisotropic conductive film on the one side of the base.
14. The organic light emitting device of claim 3 , wherein a material of the insulating layer is a polyimide-based resin.
15. The organic light emitting device of claim 1 , wherein the metal pattern is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.
16. The organic light emitting device of claim 1 , wherein the substrate is a glass substrate or a plastic substrate.
17. The organic light emitting device of claim 1 , wherein the thickness of the printed circuit board is 20 μm to 200 μm.
18. The organic light emitting device of claim 1 , wherein the thickness of the sealing layer is 10 μm to 50 μm.
19. The organic light emitting device of claim 1 , wherein the sealing layer is an adhesive including a getter.
20. The organic light emitting device of claim 1 , wherein the organic light emitting device is a flexible organic light emitting device.
21. The organic light emitting device of claim 1 , wherein one or more light-scattering layers are further included in at least one of between the substrate and the first electrode and a surface facing a surface where the first electrode is provided.
22. A display device including the organic light emitting device according to claim 1 .
23. An illumination device including the organic light emitting device according to claim 1 .
24. A method for preparing an organic light emitting device, comprising:
forming an organic emitting part by sequentially laminating a first electrode, an organic material layer, and a second electrode on a substrate; and
installing a sealing part covering an outside of the organic emitting part of the substrate,
wherein the sealing part includes a printed circuit board including a base and a metal pattern formed at an edge of one side of the base, and a sealing layer filling a space between the printed circuit board and the outside of the organic emitting part,
wherein the base is formed directly on the sealing layer.
25. The method of claim 24 , wherein the printed circuit board includes one or more metal patterns.
26. The method of claim 24 , wherein the printed circuit board includes an insulating layer provided on at least one of between the base and the metal pattern, between two or more metal patterns, and on the metal pattern.
27. The method of claim 24 , wherein the printed circuit board is a flexible printed circuit board.
28. The method of claim 24 , wherein in the installing of the sealing part, the printed circuit board and the substrate are bonded to each other by an anisotropic conductive film.
29. The method of claim 24 , wherein the sealing part further includes a metal plate which is positioned at the center of one side of the base and is not connected with the metal pattern.
30. The method of claim 29 , wherein the metal plate is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.
31. A structure of a printed circuit board, comprising:
a base;
a metal pattern provided at an edge of one side of the base,
a sealing layer provided directly on the base; and
an anisotropic conductive film provided at an edge of the other side of the base,
wherein the sealing layer is provided in an area without the anisotropic conductive film on the other side of the base.
32. The structure of claim 31 , wherein the metal pattern includes one or more metal patterns.
33. The structure of claim 32 , wherein the printed circuit board includes an insulating layer provided on at least one of between the base and the metal pattern, between two or more metal patterns, and on the metal pattern.
34. The structure of claim 31 , wherein the structure of the printed circuit board is a structure of a flexible printed circuit board.
35. The structure of claim 31 , further comprising:
a metal plate which is positioned at a center of one side of the base and is not connected with the metal pattern.
36. The structure of claim 35 , wherein the metal plate is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.
37. The structure of claim 31 , wherein the structure of the printed circuit board further includes a device in which a first electrode and a second electrode are included, and the metal pattern includes a first metal pattern which electrically connects the first electrode and an external power source, and a second metal pattern which electrically connects the second electrode and the external power source.
38. The structure of claim 33 , wherein a material of the insulating layer is a polyimide-based resin.
39. The structure of claim 31 , wherein the metal pattern is a thin film of one selected from a group consisting of copper, iron, nickel, titanium, aluminum, silver, and gold or two or more alloys thereof; or stainless steel.
40. The structure of claim 31 , wherein the thickness of the sealing layer is 10 μm to 50 μm.
41. The structure of claim 31 , wherein the sealing layer is an adhesive including a getter.