Interposer beam expander chip
View Patent ↗An interposer chip for coupling light between an array of fibers and an array of optical waveguides on a second photonic chip. The interposer chip has an array of V-grooves for aligning the ends of the fibers to corresponding ends of an array of optical waveguides on the interposer chip. Each optical waveguide has a taper with a first end and a second end, the first end being configured to support an optical mode that couples efficiently to the mode of an optical fiber. The taper reduces the vertical mode size, so that the mode supported by the second end of the taper may be efficiently coupled to a 3-micron thick optical waveguide on the second photonic chip. The interposer chip further has a hard stop having a flat surface parallel to the optical waveguides on the interposer chip, at the interface to the second chip. When the interposer chip is flipped and assembled with the second chip, the hard stop abuts against a mounting surface on the second chip, so that optical waveguides on the interposer chip are aligned, in the vertical direction, with optical waveguides on the second chip.
1. A photonic chip, comprising:
an optical waveguide on a top surface of the photonic chip, the optical waveguide having:
a first end configured to support a first optical mode having a first mode center;
a second end configured to support a second optical mode having a second mode center; and
a first tapered portion, the first tapered portion comprising a first tapered mesa and a tapered central ridge; and
a hard stop comprising a flat surface parallel to a portion of the optical waveguide at the second end of the optical waveguide,
the height of the second mode center above the flat surface of the hard stop being greater than zero and less than the thickness of the optical waveguide at the second end.
2. The photonic chip of claim 1 , wherein the flat surface of the hard stop has an area of at least 0.5 mm 2 .
3. The photonic chip of claim 2 , wherein the flat surface of the hard stop is a single rectangular area.
4. The photonic chip of claim 1 , wherein the second end of the optical waveguide has a thickness of about 3 microns.
5. The photonic chip of claim 1 , wherein the second end of the optical waveguide has a width of about 13 microns.
6. The photonic chip of claim 1 , wherein at least one of the first end and the second end of the optical waveguide comprises a flat facet, the angle between a normal vector of the facet and the direction of the optical waveguide, at the second end of the optical waveguide, being between 3 and 10 degrees.
7. The photonic chip of claim 6 , wherein the facet is perpendicular to the top surface of the photonic chip.
8. The photonic chip of claim 1 , further comprising an alignment feature, the alignment feature being a recessed feature in the hard stop.
9. The photonic chip of claim 1 , further comprising a V-groove at the first end of the optical waveguide, the V-groove being configured to secure and support the cladding of an optical fiber such that a centerline of the optical fiber is substantially aligned with the first mode center.
10. The photonic chip of claim 9 , further comprising a cantilevered extension supporting the first end of the optical waveguide above a sloping end surface of the V-groove.
11. The photonic chip of claim 1 , wherein the first end of the optical waveguide comprises a T-bar, the T-bar having the same thickness as the optical waveguide, and being composed of the same material as the optical waveguide.
12. The photonic chip of claim 1 , wherein the first end of the optical waveguide comprises a fork-bar having the same thickness as the optical waveguide, and being composed of the same material as the optical waveguide, the fork-bar comprising two tines configured to act as fiber stops.
13. The photonic chip of claim 1 , wherein:
the first tapered portion has a first end and a second end, the first end of the first tapered portion being nearer than the second end of the first tapered portion to the first end of the optical waveguide; and
the tapered central ridge has a width that decreases from a first width at the first end of the first tapered portion to near zero at the second end of the first tapered portion.
14. The photonic chip of claim 13 , wherein the first tapered mesa has a width that decreases from a second width at the first end of the first tapered portion to a third width, less than the second width, at the second end of the first tapered portion.
15. The photonic chip of claim 13 , wherein the first end of the first tapered portion is configured to support an optical mode with a vertical mode size of about 8 microns and a horizontal mode size of about 8 microns.
16. The photonic chip of claim 13 , wherein the optical waveguide further comprises a second tapered portion between the first tapered portion and the second end of the optical waveguide, the second tapered portion having a first end and a second end, the first end of the second tapered portion being nearer than the second end of the second tapered portion to the first end of the optical waveguide, the second tapered portion comprising a second tapered mesa.
17. The photonic chip of claim 16 , wherein the second tapered mesa has a width that increases from the first end of the second tapered portion to the second end of the second tapered portion.
18. The photonic chip of claim 1 suitable for use as an interposer chip for coupling light between an array of fibers and an array of optical waveguides on a second photonic chip, each fiber configured to support the first optical mode and each optical waveguide of the second photonic chip configured to support the second optical mode;
the photonic chip comprising:
a first section for accommodating the array of fibers;
a second section comprising a plurality of waveguides for transforming the first optical mode from each fiber into the second optical mode for a respective waveguide on the second photonic chip; each waveguide of the second section comprising a first end, a second end and a first tapered portion; and
a third section for optical alignment to the second photonic chip, the third section comprising the hard stop.
19. A method, utilizing the photonic chip of claim 18 as an interposer chip, of coupling light between an array of fibers and an array of optical waveguides on a second photonic chip, each fiber configured to support the first optical mode and each optical waveguide configured to support the second optical mode; the method comprising:
coupling light from a fiber of the array of fibers into a first end of the photonic chip; and
coupling light from a second end of the photonic chip into an optical waveguide on the second photonic chip.
20. The method of claim 19 , wherein the step of coupling light from the second end of the photonic chip comprises:
flipping the interposer chip onto the second photonic chip,
wherein the hard stop of the photonic chip abuts against a mounting surface on the second photonic chip to align an optical waveguide on the interposer chip with an optical waveguide on the second photonic chip.
21. An assembly comprising:
a first photonic chip, comprising:
a first optical waveguide on a top surface of the first photonic chip, the first optical waveguide having:
a first end configured to support a first optical mode having a first mode center;
a second end configured to support a second optical mode having a second mode center; and
a first tapered portion, the first tapered portion comprising a first tapered mesa and a tapered central ridge; and
a hard stop comprising a flat surface parallel to a portion of the first optical waveguide at the second end of the first optical waveguide; and
a second photonic chip having a top surface comprising a second optical waveguide having a first end,
the height of the second mode center above the flat surface of the hard stop being greater than zero and less than the thickness of the first optical waveguide at the second end,
the first photonic chip being secured to the second photonic chip, the first photonic chip being substantially parallel to, and overlapping, the second photonic chip,
the flat surface of the hard stop of the first photonic chip abutting against a region of the top surface of the second photonic chip,
the first end of the second optical waveguide being configured to support a third optical mode having a third mode center,
a portion of the first optical waveguide at the second end of the first optical waveguide being substantially parallel to a portion of the second optical waveguide at the first end of the second optical waveguide, and
the second mode center being substantially aligned with the third mode center.
22. The assembly of claim 21 , wherein the second photonic chip further comprises a hard stop having a flat surface
parallel to the portion of the second optical waveguide at the first end of the second optical waveguide, and
abutting against a region of the top surface of the first photonic chip.
23. The assembly of claim 22 , wherein:
a gap between:
the first end of the first optical waveguide, and
the first end of the second optical waveguide
is wider than a gap between:
a boundary between the hard stop of the first photonic chip and the region of the top surface of the first photonic chip, and
a boundary between the hard stop of the second photonic chip and the region of the top surface of the second photonic chip.
24. The assembly of claim 21 , wherein the first photonic chip is flip chip mounted onto the second photonic chip.