Methods for producing rectangular seeds for ingot growth
View Patent ↗A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
1. A method of producing rectangular seeds for use in semiconductor or solar material manufacturing, the method comprising:
connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots;
drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots;
connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer; and
slicing each of the quarter sections with a wire web to separate the rectangular seed portions from the curved wing portions, wherein the sliced rectangular seed portions are rectangular seeds.
2. The method of claim 1 , wherein connecting an adhesive layer includes connecting double-sided adhesive film to the top surface of the template.
3. The method of claim 1 , further comprising arranging the rectangular seeds in a directional solidification system (DSS) furnace.
4. The method of claim 3 , wherein arranging the rectangular seeds in the DSS furnace includes arranging the rectangular seeds in a grid.
5. The method of claim 1 , further comprising:
positioning the sliced curved wing portions on the template; and
bisecting each of the sliced curved wing portions into two half wings using the wire web.
6. The method of claim 5 , further comprising arranging the rectangular seeds and the half wings in a directional solidification system (DSS) furnace.
7. The method of claim 6 , wherein arranging the rectangular seeds and the half wings in the DSS furnace includes:
arranging the rectangular seeds in a grid; and
surrounding the arranged rectangular seeds with the half wings.
8. The method of claim 1 , wherein connecting the adhesive layer to the top surface of the template comprises connecting the adhesive layer to the top surface of a template including a grid of parallel horizontal slots perpendicular to parallel vertical slots.