An LED lamp comprising: an LED light-emitting module including an LED; an lens module provided in front of the LED light-emitting module; a casing accommodating the LED light-emitting module and having a sectional area decreasing toward a base located on a back portion of the LED lamp; and a heat sink configuring at least part of the casing and dissipating heat emitted by the LED.
1. A LED lamp comprising:
an LED light-emitting module including an LED;
an lens module provided in front of the LED light-emitting module;
a casing accommodating the LED light-emitting module and having a sectional area decreasing toward a base located on a back portion of the LED lamp; and
a heat sink configuring at least part of the casing and dissipating heat emitted by the LED, wherein
the heat sink comprises,
a bottom on which the LED light-emitting module and the lens module is installed,
an outer cylinder part located on a back of the bottom,
a plurality of heat dissipation fins each having a plate shape, arranged on an outer circumference edge of the bottom and extending in forward and lateral directions of the bottom, and connected to an outer circumference surface of the outer cylinder part and extending in lateral directions of the outer circumference surface, and
a heat dissipation body having a beltlike shape and connecting portions on an outer circumference side of the heat dissipation fins to each other.
2. The LED lamp according to claim 1 , wherein the heat dissipation body is provided to cover the casing such that the heat dissipation body covers an predetermined area of the casing from the outermost diameter of the casing toward the bottom when the casing is viewed from a base side.
3. The LED lamp according to claim 1 , wherein at least part of the heat dissipation body is extended forward from the bottom.
4. The LED lamp according to claim 1 , wherein the heat dissipation body is provided to cover the casing such that the heat dissipation body covers an area of 10% or more to 40% or less of an outermost diameter of the casing from the outermost diameter of the casing toward the bottom when the casing is viewed from a base side.
5. The LED lamp according to claim 1 , wherein the bottom has a substantially cylindrical shape, and
at least part of the plurality of heat dissipation fins are arranged radially on the outer circumference edge of the bottom.
6. The LED lamp according to claim 1 , wherein a treatment for improving a heat radiation rate is applied to each of the bottom, the heat dissipation fins, and the heat dissipation body of the heat sink.
7. The LED lamp according to claim 6 , wherein a heat radiation rate improving film for improving the heat radiation rate is provided on each of the bottom, the heat dissipation fins, and the heat dissipation body of the heat sink.
8. The LED lamp according to claim 1 , wherein the LED lamp is an MR16 LED lighting fixture, an MR11 LED lighting fixture, an AR111 LED lighting fixture or a PAR LED lighting fixture.
9. The LED lamp according to claim 1 , wherein the LED lamp has a shape and a size replaceable with an MR16 halogen bulb, and
the heat dissipation body has a height of 5 mm or more to 20 mm or less.
10. The LED lamp according to claim 1 , wherein the heat dissipation body of the heat sink is different from the bottom and the heat dissipation fins in the heat radiation rate.
11. The LED lamp according to claim 1 , wherein a surface area of the heat dissipation body is larger than a surface area of the heat dissipation body in the case where the heat dissipation body is along an outer shape of the casing.
12. The LED lamp according to claim 1 , wherein at least part of the plurality of heat dissipation fins are arranged at fixed intervals on the outer circumference edge of the bottom.
13. The LED lamp according to claim 1 , wherein in the LED light-emitting module, the LED is mounted on a substantial center of a board to be disposed such that an optical axis of the LED and a center of the bottom substantially correspond with each other.
14. The LED lamp according to claim 1 , wherein an LED chip of the LED includes a GaN substrate.