Method of making RFID devices on fabrics by stitching metal wires
A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to a piece of fabric. The RFID semiconductor chip includes two terminals. A solid wire is stitched into the fabric making an RFID antenna. The solid wire is attached to the terminals of the RFID semiconductor chip. In a second example, a metal wire is selected. The metal wire is stitched into fabric making an RFID antenna. The metal wire includes two ends and a conductive adhesive is applied to two ends of the metal wire. An RFID semiconductor chip is attached to the fabric. The RFID semiconductor chip includes two terminals and the RFID semiconductor chip is attached to the fabric at the two terminals. The conductive adhesive is cured. In both examples, the wire and the RFID semiconductor chip are encapsulated in fabric.
1. A method for making a Radio Frequency Identification (RFID) device on fabric, the method comprising:
attaching an RFID semiconductor chip to a piece of fabric, wherein the RFID semiconductor chip includes at least two terminals;
stitching a solid wire into the fabric to make an RFID antenna;
attaching the solid wire to the at least two terminals of the RFID semiconductor chip; and
encapsulating the solid wire and the RFID semiconductor chip.
2. The method of claim 1 , wherein the RFID semiconductor chip is attached to the fabric using an epoxy based adhesive.
3. The method of claim 1 , wherein the solid wire is an insulated wire.
4. The method of claim 3 , wherein the insulated wire is at least one of silver, copper, and aluminum.
5. The method of claim 1 , wherein the solid wire is a non-insulated wire.
6. The method of claim 1 , wherein the solid wire is stitched into the fabric in a design pattern.
7. The method of claim 1 wherein the solid wire is attached to the RFID semiconductor chip by soldering.
8. The method of claim 1 , wherein the solid wire is attached to the RFID semiconductor chip by welding.
9. The method of claim 1 , wherein the solid wire is attached to the RFID semiconductor chip using a conductive adhesive.
10. The method of claim 1 , wherein the solid wire is stitched into the fabric using an automatic sewing machine.
11. A method for making a Radio Frequency Identification (RFID) device on fabric, the method comprising:
selecting a metal wire;
stitching the metal wire into fabric to make an RFID antenna, wherein the metal wire includes at least two ends;
applying a conductive adhesive to the at least two ends of the metal wire;
attaching an RFID semiconductor chip to the fabric, wherein the RFID semiconductor chip includes at least two terminals and the RFID semiconductor chip is attached to the fabric with the at least two terminals corresponding to the at least two ends of the metal wire;
curing the conductive adhesive; and
encapsulating the metal wire and the RFID semiconductor chip.
12. The method of claim 11 , wherein the metal wire is an insulated wire.
13. The method of claim 12 , wherein the insulated wire is at least one of silver, copper, and aluminum.
14. The method of claim 11 , wherein the metal wire is a non-insulated wire.
15. The method of claim 11 , wherein the metal wire is stitched into the fabric in a design pattern.
16. The method of claim 11 , wherein the metal wire is stitched into the fabric using an automatic sewing machine.