Low application temperature hot melt adhesive
View Patent ↗The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
1. An adhesive composition consisting of:
(a) at least greater than about 5 wt % of an ethylene monomer with at least one of C 3 to C 20 α-olefin comonomer produced by metallocene catalysis polymerization, having an average Melt Index range of about 5 to about 35 g/10 minutes at 190° C.
(b) an amorphous poly-α-olefin copolymer or a random copolymer having an average Melt Index range greater than about 35 g/10 minutes at 190° C.;
(c) a tackifier having a softening point of 115° C. or less
(d) a diluent; and
(e) optionally, wax, antioxidant, stabilizer pigment, or mixtures thereof.