The wiring board of the present invention includes at least one insulating layer and at least one conductor layer being alternately laminated, a semiconductor element connection pad formed on an upper surface of the insulating layer at an uppermost layer of the insulating layers, a cap connection pattern arranged so as to surround a region where the semiconductor element connection pad is formed, and at least one strip-shaped pattern extending from the semiconductor element connection pad to a region outside an end portion on the region side of the cap connection pattern. The cap connection pattern is formed by a plurality of island-shaped patterns spaced apart from one another, and the strip-shaped pattern is formed between the adjacent island-shaped patterns on the upper surface of the insulating layer at the uppermost layer.
1. A wiring board comprising:
at least one insulating layer and at least one conductor layer being alternately laminated;
a semiconductor element connection pad including the conductor layer, formed on an upper surface of the insulating layer at an uppermost layer of the insulating layers;
a cap connection pattern including the conductor layer, electrically connected to a metal cap with a solder, arranged so as to surround a region, in a plan view, where the semiconductor element connection pad is formed; and
at least one strip-shaped pattern including the conductor layer, extending from the semiconductor element connection pad to a region outside an end portion on the region side of the cap connection pattern,
wherein the cap connection pattern is formed by a plurality of island-shaped patterns spaced apart from one another, and
wherein the strip-shaped pattern is formed between the adjacent island-shaped patterns on the upper surface of the insulating layer at the uppermost layer.
2. The wiring board according to claim 1 , wherein at least one strip-shaped pattern of the strip-shaped patterns extends through between the adjacent island-shaped patterns.
3. The wiring board according to claim 1 , wherein at least one strip-shaped pattern of the strip-shaped patterns includes a tip arranged between the adjacent island-shaped patterns.
4. A semiconductor device comprising:
the wiring board according to claim 1 ;
a semiconductor element mounted on the wiring board; and
a metal cap electrically connected to the cap connection pattern formed in the wiring board with solder interposed therebetween.