(Meth)acrylate polymer, a resin composition and a shaped article
Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 μm, a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below, a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more. This polymer has excellent dispersibility of primary particles in a resin, excellent storage stability of a resin composition obtained, and excellent insulating properties and reduction in elastic modulus of a molded article obtained.
1. A resin composition comprising:
100 parts by mass of a curable resin; and
0.1 to 50 parts by mass of a (meth)acrylate polymer having the following properties: a volume average primary particle size of 0.520 to 3.00 μm; a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below; a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more; and an acetone-insoluble component of 99% by mass or more;
wherein the (meth)acrylate polymer contains 81 to 98% by mass of a rubbery (meth)acrylate polymer (A) having a glass transition temperature of −40° C. or below and 2 to 19% by mass of a polymerized monomer mixture (b), which is polymerized in the presence of said rubbery (meth)acrylate polymer (A), totaling 100% by mass;
said rubbery (meth)acrylate polymer (A) is obtained by polymerizing a monomer mixture (a) comprising 0.0001 to 2.5% by mass of a cross-linkable monomer (a1) and 69.999 to 99.999% by mass of a (meth)acrylate monomer (a2) capable of giving a homopolymer having a glass transition temperature of −40° C. or below, based on 100% by mass of monomer mixture (a); and
said monomer mixture (b) comprises 0.1% by mass or more of a cross-linkable monomer (b1) and 99.9% by mass or less of a vinyl monomer (b2), based on 100% by mass of monomer mixture (b).
2. The resin composition according to claim 1 , wherein the curable resin is an epoxy resin.
3. The resin composition according to claim 2 , further comprising a curing agent.
4. The resin composition according to claim 1 , further comprising a curing agent.
5. A shaped article obtained with shaping of the resin composition according to claim 1 .
6. A sealing material for semiconductors comprising:
100 parts by mass of a curable resin; and
0.1 to 50 parts by mass of a (meth)acrylate polymer having the following properties: a volume average primary particle size of 0.520 to 3.00 μm; a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below; a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more; and an acetone-insoluble component of 99% by mass or more;
wherein the (meth)acrylate polymer contains 81 to 98% by mass of a rubbery (meth)acrylate polymer (A) having a glass transition temperature of −40° C. or below and 2 to 19% by mass of a polymerized monomer mixture (b), which is polymerized in the presence of said rubbery (meth)acrylate polymer (A), totaling 100% by mass;
said rubbery (meth)acrylate polymer (A) is obtained by polymerizing a monomer mixture (a) comprising 0.0001 to 2.5% by mass of a cross-linkable monomer (a1) and 69.999 to 99.999% by mass of a (meth)acrylate monomer (a2) capable of giving a homopolymer having a glass transition temperature of −40° C. or below, based on 100% by mass of monomer mixture (a); and
said monomer mixture (b) comprises 0.1% by mass or more of a cross-linkable monomer (b1) and 99.9% by mass or less of a vinyl monomer (b2), based on 100% by mass of monomer mixture (b).
7. The sealing material according to claim 6 , wherein said curable resin is an epoxy resin.
8. The sealing material according to claim 6 , further comprising a curing agent.
9. An adhesive comprising:
100 parts by mass of a curable resin; and
0.1 to 50 parts by mass of a (meth)acrylate polymer having the following properties: a volume average primary particle size of 0.520 to 3.00 μm; a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below; a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more; and an acetone-insoluble component of 99% by mass or more;
wherein the (meth)acrylate polymer contains 81 to 98% by mass of a rubbery (meth)acrylate polymer (A) having a glass transition temperature of −40° C. or below and 2 to 19% by mass of a polymerized monomer mixture (b), which is polymerized in the presence of said rubbery (meth)acrylate polymer (A), totaling 100% by mass;
said rubbery (meth)acrylate polymer (A) is obtained by polymerizing a monomer mixture (a) comprising 0.0001 to 2.5% by mass of a cross-linkable monomer (a1) and 69.999 to 99.999% by mass of a (meth)acrylate monomer (a2) capable of giving a homopolymer having a glass transition temperature of −40° C. or below, based on 100% by mass of monomer mixture (a); and
said monomer mixture (b) comprises 0.1% by mass or more of a cross-linkable monomer (b1) and 99.9% by mass or less of a vinyl monomer (b2), based on 100% by mass of monomer mixture (b).
10. The adhesive according to claim 9 , wherein said curable resin is an epoxy resin.
11. The adhesive according to claim 9 , further comprising a curing agent.