Material-removal systems, cutting tools therefor, and related methods
View Patent ↗Embodiments described herein relate to material-removal systems and cutting tools that may be used in the material-removal systems. More specifically, for example, the material-removal systems, and particularly the cutting tools thereof, may engage and fail target material. In some instances, the material-removal systems may be used in mining operations.
1. A material-removal system, comprising:
a movable cutting head; and
a plurality of cutting tools mounted on the cutting head, each of the plurality of cutting tools including a tool body having a front surface, a front slanted surface extending from the front surface, a back surface, one or more surfaces defining a pocket formed in the tool body between the front slanted surface and the back surface, and a cutting element brazed to the tool body to secure the cutting element at least partially within the pocket;
wherein:
each of the cutting elements of the plurality of cutting tools includes:
a substrate brazed directly to at least one of the one or more surfaces defining the pocket, the substrate having a back surface and a front surface opposite to the back surface; and
a superhard table bonded directly to the front surface of the substrate and including a substantially planar working surface offset from the front slanted surface and oriented at a back rake angle and a side rake angle with respect to the back surface of the substrate; and
at least two of the plurality of cutting tools are positioned at different locations on the cutting head.
2. The material-removal system of claim 1 , wherein at least one of the plurality of cutting tools has a different side rake angle than other cutting tools of the plurality of cutting tools.
3. The material-removal system of claim 2 , wherein the cutting element of a first cutting tool of the plurality of cutting tools has a larger side rake angle than the cutting element of a second cutting tool of the plurality of cutting tools, and the first cutting tool is located closer to a rotation axis of the movable cutting head than the second cutting tool.
4. The material-removal system of claim 1 , wherein at least some of the cutting elements of the plurality of cutting tools include a nonplanar interface between the superhard table and the substrate thereof.
5. The material-removal system of claim 4 , wherein the superhard table and the substrate include one or more complementary grooves and protrusions that form the nonplanar interface therebetween.
6. The material-removal system of claim 5 , wherein the superhard table of a first cutting tool of the plurality of cutting tools has a larger chamfer than the superhard table of a second cutting tool of the plurality of cutting tools, and the first cutting tool is located closer to a rotation axis of the movable cutting head than the second cutting tool.
7. The material-removal system of claim 1 , wherein at least some of the cutting elements of the plurality of cutting tools include a chamfer at least partially surrounding the substantially planar working surface.
8. The material-removal system of claim 1 , wherein one or more of the back rake angle or side rake angle is from 15 degrees to 20 degrees and the superhard table has a greater thickness on a first side than a second side to form the back rake angle and the side rake angle.
9. The material-removal system of claim 1 , wherein the back rake angle is 15 degrees to 20 degrees with respect to the back surface of the substrate.
10. The material-removal system of claim 9 , wherein the back rake angle is a negative back rake angle.
11. The material-removal system of claim 1 , wherein the side rake angle is 15 degrees to 20 degrees.
12. The material-removal system of claim 1 , wherein the substantially planar working surface has a trapezoidal shape.
13. The material-removal system of claim 1 , wherein:
the one or more surfaces defining the pocket formed in the tool body of each cutting tool of the plurality of cutting tools includes include:
a first surface intersecting the front slanted surface and shaped complementary to a portion of the substrate, the first surface interfacing only a portion of a circumference of the substrate; and
a second surface intersecting the back surface of the tool and interfacing the back surface of the substrate;
the substrate of each of the cutting elements extends from the pocket past the front slanted surface; and
the tool body of each cutting tool of the plurality of cutting tools includes:
an elongated portion having a width substantially equal to a width of the cutting element; and
a base portion having a width greater than the width of the elongated portion, the base portion being configured to secure the cutting tool to the movable cutting head.
14. A method of removing material, the method comprising:
moving a plurality of cutting tools about a rotation axis, each of the plurality of cutting tools includes a tool body including a front surface, a front slanted surface extending from the front surface, a back surface, and one or more surfaces defining a pocket formed in the tool body between the front slanted surface and the back surface, at least two of the plurality of cutting tools being positioned at different positions, and each of the plurality of cutting tools including a substrate having a front surface bonded directly to a superhard table that forms a working surface that is offset from the front slanted surface and at least a portion of a cutting end of the cutting tool, wherein the substrate of each of the plurality of cutting tools has a back surface opposite to the front surface and brazed directly to at least one surface of the pocket of the tool body thereof to secure the substrate at least partially within the pocket thereof;
advancing the plurality of cutting tools toward a target material; and
engaging the cutting ends and the working surfaces of the cutting tools with the target material, thereby failing at least some of the target material while having the working surfaces of the cutting tools oriented at a back rake angle and a side rake angle with respect to the back surface of the substrate.
15. The method of claim 14 , wherein the back rake angle is a positive back rake angle.
16. The method of claim 15 , wherein the side rake angle of one or more cutting tools opens away from the rotation axis.
17. The method of claim 14 , wherein the back rake angle is a negative back rake angle.
18. The method of claim 14 , wherein a first cutting tool of the plurality of cutting tools has a larger side rake angle than a second cutting tool of the plurality of cutting tools, and the first cutting tool is located closer to a rotation axis than the second cutting tool.
19. The method of claim 14 , wherein the superhard table of a first cutting tool of the plurality of cutting tools has a larger chamfer than the superhard table of a second cutting tool of the plurality of cutting tools, and the first cutting tool is located closer to a rotation axis than the second cutting tool.
20. A material-removal system, comprising:
a cutting head rotatable about a rotation axis; and
a plurality of cutting tools mounted on the cutting head, each of the plurality of cutting tools including a tool body having a front surface, a front slanted surface extending from the front surface, a back surface, one or more surfaces defining a pocket formed in the tool body between the front slanted surface and the back surface, and a cutting element brazed to the tool body to secure the cutting element at least partially within the pocket;
wherein:
each of the cutting elements of the plurality of cutting tools includes:
a substrate brazed directly to at least one of the one or more surfaces defining the pocket, the substrate having a back surface and a front surface opposite to the back surface; and
a polycrystalline diamond table bonded directly to the front surface of the substrate, the polycrystalline diamond table includes a substantially planar working surface offset from the front slanted surface and oriented at a back rake angle of 15 degrees to 20 degrees and a side rake angle of 15 degrees to 20 degrees with respect to the back surface of the substrate; and
at least two of the plurality of cutting tools are positioned at different radial locations relative to the rotation axis of the cutting head.
21. The material-removal system of claim 20 , wherein the back rake angle is a negative back rake angle or a positive back rake angle.
22. The material-removal system of claim 20 , wherein side rake angle is a negative side rake angle or a positive side rake angle.
23. The material-removal system of claim 20 , wherein at least one of the plurality of cutting tools has a different side rake angle than other cutting tools of the plurality of cutting tools.
24. The material-removal system of claim 23 , wherein the cutting element of a first cutting tool of the plurality of cutting tools has a larger side rake angle than the cutting element of a second cutting tool of the plurality of cutting tools, and the first cutting tool is located closer to the rotation axis than the second cutting tool.
25. The material-removal system of claim 24 , wherein the polycrystalline diamond table of a first cutting tool of the plurality of cutting tools has a larger chamfer than the polycrystalline diamond table of a second cutting tool of the plurality of cutting tools, and the first cutting tool is located closer to the rotation axis than the second cutting tool.
26. The material-removal system of claim 20 , wherein at least some of the polycrystalline diamond tables of the plurality of cutting tools include a chamfer at least partially surrounding the substantially planar working surface.