Bond pad sharing for powering a multiplicity of electrical components of a recording head

1. An apparatus, comprising:

a slider of a recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground pad;

a plurality of electrical components of the slider each coupled to at least one of the electrical bond pads;

at least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components;

a first electrical component is coupled between first and second electrical bond pads;

a second electrical component is coupled between the second electrical bond pad and a ground pad of the slider;

at least one diode is coupled to the second electrical bond pad and the second electrical component; and

the first and second components are energized alternately depending on the polarity of the first and second electrical bond pads.

2. The apparatus of claim 1 , wherein:

the first electrical component is a thermal sensor; and

the second electrical component is a heater situated proximate a reader.

3. The apparatus of claim 1 , wherein:

the first electrical component is a thermal sensor; and

the second electrical component is a heater situated proximate a writer.

4. The apparatus of claim 1 , wherein:

the first electrical component is a reader of the slider; and

the second electrical component is a heater situated proximate a writer.

5. The apparatus of claim 1 , wherein:

a reader is coupled between first and second electrical bond pads;

a heater situated proximate a writer is coupled between the second electrical bond pad and the ground pad of the slider;

a first diode is coupled to the second electrical bond pad and the writer heater;

a thermal sensor is coupled between third and fourth electrical bond pads;

a heater situated proximate a reader is coupled between the fourth electrical bond pad and a ground pad of the slider; and

a second diode is coupled to the fourth electrical bond pad and the reader heater.

6. The apparatus of claim 5 , wherein:

the reader and the writer heater are energized alternately depending on the polarity of the first and second electrical bond pads; and

the thermal sensor and the reader heater are energized alternately depending on the polarity of the third and fourth electrical bond pads.

7. The apparatus of claim 5 , wherein the writer heater and the reader heater are arranged to be energized concurrently.

8. The apparatus of claim 1 , wherein:

at least the first and second electrical components are coupled in parallel between the first and second electrical bond pads.

9. The apparatus of claim 1 , wherein:

the first electrical component and the second electrical components are coupled in parallel between the first electrical bond pad and the second electrical bond pad;

a first diode is coupled to the first electrical component;

a second diode is coupled to the second electrical component; and

the first and second diodes are arranged to conduct alternately depending on the polarity of the first and second electrical bond pads.

10. The apparatus of claim 1 , wherein:

the first electrical component is a thermal sensor; and

the second electrical component is a bolometric sensor.

11. The apparatus of claim 1 , further comprising a Zener diode coupled between the at least one diode and the second electrical bond pad.

12. An apparatus, comprising:

a slider of a heat-assisted magnetic recording head comprising:

a near-field transducer proximate an optical waveguide;

a reader and a writer, the writer situated proximate the near-field transducer;

a plurality of electrical bond pads coupled to bias sources and a ground pad;

a plurality of electrical components of the slider each coupled to at least one of the electrical bond pads;

at least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components;

a first electrical component is coupled between first and second electrical bond pads;

a second electrical component is coupled between the second electrical bond pad and a ground pad of the slider;

at least one diode is coupled to the second electrical bond pad and the second electrical component; and

the first and second components are energized alternately depending on the polarity of the first and second electrical bond pads.

13. The apparatus of claim 12 , wherein:

the first electrical component is a thermal sensor; and

the second electrical component is one of a heater situated proximate the reader and a heater situated proximate the writer.

14. The apparatus of claim 12 , wherein:

the first electrical component is a reader of the slider; and

the second electrical component is a heater situated proximate the writer.

15. The apparatus of claim 12 , wherein:

at least the first and second electrical components are coupled in parallel between the first and second electrical bond pads.

16. The apparatus of claim 12 , wherein:

the first electrical component and the second electrical component are coupled in parallel between the first electrical bond pad and the second electrical bond pad;

a first diode is coupled to the first electrical component;

a second diode is coupled to the second electrical component; and

the first and second diodes are arranged to conduct alternately depending on the polarity of the first and second electrical bond pads.

17. The apparatus of claim 16 , wherein:

the first electrical component is a thermal sensor; and

the second electrical component is a bolometric sensor.

18. The apparatus of claim 12 , further comprising a Zener diode coupled between the at least one diode and the second electrical bond pad.