Trench structure of semiconductor device having uneven nitrogen distribution liner
A trench structure of a semiconductor device includes a substrate, an isolation structure, and a liner layer. The substrate has a trench therein. The isolation structure is disposed in the trench. The liner layer is disposed between the substrate and the isolation structure. The liner layer includes nitrogen, and the liner layer has spatially various nitrogen concentration.
1. A trench structure of a semiconductor device, comprising:
a substrate having a trench therein, wherein the trench has a bottom surface, a top portion, a middle portion, and a bottom portion, the middle portion is disposed between the top portion and the bottom portion, and the bottom portion is closer to the bottom surface than the top portion;
an isolation structure disposed in the trench; and
a liner layer disposed between the substrate and the isolation structure, wherein the liner layer comprises nitrogen, and a nitrogen concentration of the liner layer at the middle portion is lower than a nitrogen concentration of the liner layer at the bottom portion.
2. The trench structure of claim 1 , wherein the trench further has at least one sidewall, and the liner layer covers the bottom surface and the sidewall of the trench.
3. The trench structure of claim 1 , wherein a nitrogen concentration of the liner layer at the top portion is higher than the nitrogen concentration of the liner layer at the middle portion.
4. The trench structure of claim 1 , wherein the substrate further comprises:
a plurality of semiconductor fins, wherein the trench is disposed between adjacent two of the semiconductor fins.
5. The trench structure of claim 4 , wherein the liner layer conformally covers at least one of the semiconductor fins.
6. The trench structure of claim 1 , wherein the liner layer is made of silicon oxynitride.
7. The trench structure of claim 1 , wherein the liner layer is disposed adjacent to the substrate.
8. A trench structure of a semiconductor device, comprising:
a substrate having a first trench and a second trench therein;
a first isolation structure and a second isolation structure respectively disposed in the first trench and the second trench;
a first liner layer at least disposed between the substrate and the first isolation structure;
a second liner layer at least disposed between the substrate and the second isolation structure, wherein the first liner layer is connected to the second liner layer; and
a semiconductor fin disposed between the first trench and the second trench, wherein the semiconductor fin has a sidewall, the sidewall of the semiconductor fin has a top portion, a middle portion, and a bottom portion, the middle portion is disposed between the top portion and the bottom portion, the first liner layer is in contact with the sidewall of the semiconductor fin, and a nitrogen concentration of the first liner layer in contact with the middle portion is lower than a nitrogen concentration of the first liner layer in contact with the bottom portion, and the nitrogen concentration of the first liner layer in contact with the middle portion is lower than a nitrogen concentration of the first liner layer on a bottom surface of the first trench.
9. The trench structure of claim 8 , wherein a nitrogen concentration of the second liner layer is unevenly distributed.
10. The trench structure of claim 8 , wherein the first liner layer and the second liner layer are integrally formed.
11. The trench structure of claim 8 , wherein the first liner layer is adjacent to the substrate.
12. The trench structure of claim 8 , wherein the first liner layer and the second liner layer together cover the semiconductor fin.
13. The trench structure of claim 8 , wherein the first liner layer is made of silicon oxynitride.
14. The trench structure of claim 13 , wherein the second liner layer is made of silicon oxynitride.
15. The trench structure of claim 11 , wherein the second liner layer is adjacent to the substrate.
16. The trench structure of claim 8 , wherein the nitrogen concentration of the first liner layer in contact with the middle portion is lower than a nitrogen concentration of the first liner layer in contact with the top portion.
17. The trench structure of claim 8 , wherein a nitrogen concentration of the first liner layer in contact with the top portion is higher than the nitrogen concentration of the first liner layer in contact with the bottom portion.
18. A trench structure of a semiconductor device, comprising:
a substrate having a first trench and a second trench to define a semiconductor fin therebetween;
a liner layer conformally disposed on the semiconductor fin, the first trench, and the second trench, wherein the semiconductor fin has a sidewall, the sidewall of the semiconductor fin has a top portion, a middle portion, and a bottom portion, the middle portion is disposed between the top portion and the bottom portion, the liner layer is in contact with the sidewall of the semiconductor fin and a bottom surface of the first trench, and a nitrogen concentration of the liner layer in contact with the middle portion is lower than a nitrogen concentration of the liner layer in contact with the bottom surface of the first trench;
a first isolation structure disposed in the first trench and on the liner layer; and
a second isolation structure disposed in the second trench and on the liner layer.
19. The trench structure of claim 18 , wherein the nitrogen concentration of the liner layer in contact with the middle portion is lower than a nitrogen concentration of the liner layer in contact with the top portion.
20. The trench structure of claim 18 , wherein a nitrogen concentration of the liner layer in contact with the top portion is higher than the nitrogen concentration of the liner layer in contact with the bottom surface of the first trench.