Semiconductor package modules, memory cards including the same, and electronic systems including the same

1. A semiconductor package module comprising:

a first substrate;

a second substrate disposed to face the first substrate; and

an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires,

wherein portions of the plurality of wires are twisted and wound together and are bent to extend in a predetermined direction,

wherein the plurality of wires include a first wire portion and a second wire portion;

wherein the first wire portion includes a first line portion disposed to extend from the first substrate toward the second substrate and a first wave portion bent in the predetermined direction with a wave shape;

wherein the second wire portion includes a second line portion disposed to extend from the second substrate toward the first substrate and a second wave portion bent in the predetermined direction with a wave shape;

wherein the first wave portion and the second wave portion are twisted and wound together into a spiral shape; and

wherein an end of the first wave portion opposite to the first line portion and an end of the second wave portion opposite to the second line portion are covered by a protection member.

2. The semiconductor package module of claim 1 , wherein each of the wires includes a plurality of strands.

3. A semiconductor package module of claim 1 , wherein the first substrate or the second substrate includes a printed circuit board (PCB), an organic substrate or an insulation substrate.

4. The semiconductor package module of claim 1 , wherein the protection member has a tube shape.

5. The semiconductor package module of claim 1 , wherein the protection member includes polymer containing silicone.

6. The semiconductor package module of claim 1 ,

wherein the plurality of wires include a first wire portion, a second wire portion, a third wire portion and a fourth wire portion;

wherein the predetermined direction is a first direction parallel with surfaces of the first and second substrates;

wherein the first wire portion includes a first wave portion extending from the second substrate toward the first substrate and a second wave portion extending from the first wave portion in the first direction;

wherein the second wire portion includes a third wave portion extending from the first substrate toward the second substrate and a fourth wave portion extending from the third wave portion in the first direction;

wherein the third wire portion includes a fifth wave portion extending from the second substrate toward the first substrate and a sixth wave portion extending from the fifth wave portion in a second direction opposite to the first direction;

wherein the fourth wire portion includes a seventh wave portion extending from the first substrate toward the second substrate and a eighth wave portion extending from the seventh wave portion in the second direction;

wherein the first and fifth wave portions are twisted and wound together in a spiral shape to provide a first end of the interconnection member;

wherein the second and fourth wave portions are twisted and wound together in a spiral shape to provide a second end of the interconnection member;

wherein the third and seventh wave portions are twisted and wound together in a spiral shape to provide a third end of the interconnection member; and

wherein the sixth and eighth wave portions are twisted and wound together in a spiral shape to provide a fourth end of the interconnection member.

7. The semiconductor package module of claim 6 , further comprising protection members covering the second and fourth ends, respectively.

8. The semiconductor package module of claim 1 ,

wherein each of the protection members includes a polymer containing silicone.

9. The semiconductor package module of claim 1 , wherein the interconnection member includes gold (Au), silver (Ag) or copper (Cu).

10. A semiconductor package module comprising:

a circuit substrate having a surface;

a bonding pad disposed on the surface;

a semiconductor package including a semiconductor chip and disposed to face the bonding pad of the circuit substrate; and

an interconnection member electrically connecting the bonding pad of the circuit substrate to the semiconductor package and including a plurality of wires,

wherein portions of the plurality of wires are twisted and wound together and are bent to extend in a predetermined direction,

wherein the plurality of wires include a first wire portion and a second wire portion;

wherein the first wire portion includes a first line portion disposed to extend from the bonding pad toward the second substrate pad and a first wave portion bent in the predetermined direction with a wave shape;

wherein the second wire portion includes a second line portion disposed to extend from the second substrate pad toward the bonding pad and a second wave portion bent in the predetermined direction with a wave shape;

wherein the first wave portion and the second wave portion are twisted and wound together into a spiral shape; and

wherein an end of the first wave portion opposite to the first line portion and an end of the second wave portion opposite to the second line portion are covered by a protection member.

11. The semiconductor package module of claim 10 , wherein each of the wires includes a plurality of strands.

12. The semiconductor package module of claim 10 ,

wherein the circuit substrate includes a printed circuit board (PCB), an organic substrate or an insulation substrate.

13. The semiconductor package module of claim 10 ,

wherein the semiconductor package includes a package substrate and the semiconductor chip is mounted on the package substrate;

wherein the package substrate includes a first surface and a first substrate pad is disposed on the first surface of the package substrate,

wherein the package substrate includes a second surface and a second substrate pad connected to an end of the interconnection member is disposed on the second surface of the package substrate,

wherein the first surface is opposite to the second surface.

14. The semiconductor package module of claim 10 , wherein the protection member includes a polymer containing silicone.

15. The semiconductor package module of claim 13 ,

wherein the plurality of wires include a first wire portion, a second wire portion, a third wire portion and a fourth wire portion;

wherein the predetermined direction is a first direction parallel with surfaces of the first and second substrates;

wherein the first wire portion includes a first wave portion extending from the second substrate pad toward the bonding pad and a second wave portion extending from the first wave portion in the first direction;

wherein the second wire portion includes a third wave portion extending from the bonding pad toward the second substrate pad and a fourth wave portion extending from the third wave portion in the first direction;

wherein the third wire portion includes a fifth wave portion extending from the second substrate pad toward the bonding pad and a sixth wave portion extending from the fifth wave portion in a second direction opposite to the first direction;

wherein the fourth wire portion includes a seventh wave portion extending from the bonding pad toward the second substrate pad and a eighth wave portion extending from the seventh wave portion in the second direction;

wherein the first and fifth wave portions are twisted and wound together in a spiral shape to provide a first end of the interconnection member;

wherein the second and fourth wave portions are twisted and wound together in a spiral shape to provide a second end of the interconnection member;

wherein the third and seventh wave portions are twisted and wound together in a spiral shape to provide a third end of the interconnection member; and

wherein the sixth and eighth wave portions are twisted and wound together in a spiral shape to provide a fourth end of the interconnection member.

16. The semiconductor package module of claim 15 , further comprising protection members covering the second and fourth ends, respectively.

17. The semiconductor package module of claim 16 ,

wherein each of the protection members includes a polymer containing silicone.

18. The semiconductor package module of claim 10 , wherein the interconnection member includes gold (Au), silver (Ag) or copper (Cu).