IP Library Granted Patent US 9,733,486
Granted Patent B2
US 9,733,486 · App. 14/814,297 · Granted Aug 15, 2017

Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing

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Quick Facts
Patent No.
US 9,733,486
App. No.
14/814,297
Granted
Aug 15, 2017
Kind
B2
Abstract

Imager arrays, array camera modules, and array cameras in accordance with embodiments of the invention utilize pixel apertures to control the amount of aliasing present in captured images of a scene. One embodiment includes a plurality of focal planes, control circuitry configured to control the capture of image information by the pixels within the focal planes, and sampling circuitry configured to convert pixel outputs into digital pixel data. In addition, the pixels in the plurality of focal planes include a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information, and the pixel stack defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area.

Claims (31)

1. An imager array, comprising:

a plurality of focal planes, where each of the plurality of focal planes comprises a two dimensional arrangement of pixels having at least two pixels in each dimension having a pixel pitch and each of the plurality of focal planes is contained within a region of the imager array that does not contain pixels from another one of the plurality of focal planes;

control circuitry configured to control the capture of image information by the at least two pixels in each dimension within each of the plurality of focal planes; and

sampling circuitry configured to convert pixel outputs into digital pixel data; wherein the pixels in the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information;

wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area and pixel stacks of each of the at least two pixels in each dimension of each of the plurality of focal planes are arranged to have a ratio of active area to pixel pitch that causes at least a certain amount of desired aliasing in the image information captured by the sampling circuitry.

2. The imager array of claim 1 , wherein the pixel aperture of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes is formed by a microlens that is smaller than the pixel area.

3. The imager array of claim 2 , wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in the at least two pixels in each dimension of each of the plurality of focal planes.

4. The imager array of claim 3 , wherein light is prevented from entering the pixel stacks through the gaps between the adjacent microlenses by a light blocking material.

5. The imager array of claim 4 , wherein photoresist is located in the gaps between the adjacent microlenses.

6. The imager array of claim 2 , wherein the amount of aliasing in the image information captured by one of the plurality of focal planes is greater than the amount of aliasing that would be present were the microlens to occupy the entire pixel area defined by the pixel stack.

7. The imager array of claim 2 , wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes further comprises an oxide layer and the microlens sits atop the oxide layer.

8. The imager array of claim 7 , wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes includes a color filter.

9. The imager array of claim 8 , wherein the color filter in the pixel stack of each pixel in the at least two pixels in each dimension of a one of the plurality of focal planes is the same.

10. The imager array of claim 8 , wherein the color filters in the pixel stacks of the pixels in the at least two pixels in each dimension of a one of the plurality of focal planes form a Bayer filter pattern.

11. The imager array of claim 7 , wherein the pixel stack of each pixel in the at least two pixels in each dimension of a one of the plurality of focal planes does not include a color filter.

12. The imager array of claim 7 , wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes includes a nitride passivation layer and a bottom oxide layer that provides support and isolation for metal interconnects.

13. The imager array of claim 1 , wherein the pixel aperture of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes is formed using at least one light blocking material.

14. An array camera module, comprising:

an imager array configured to capture light field image data, comprising:

a plurality of focal planes, where each of the plurality of focal planes comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each of the plurality of focal planes is contained within a region of the imager array that does not contain pixels from another one of the plurality of focal planes;

control circuitry configured to control the capture of image information from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes; and

sampling circuitry configured to convert pixel outputs from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes into digital pixel data;

wherein each pixel from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information;

wherein the pixel stack in each pixel defines a pixel area and includes a pixel aperture, where the size of the pixel aperture is smaller than the pixel area;

an optic array of lens stacks, where each of the lens stacks in the optical array form an image including aliasing on a particular one of the plurality of focal planes; and

wherein pixel stacks of each of the at least two pixels in each dimension of each of the plurality of focal planes are arranged to have a ratio of active area to pixel pitch that causes at least a certain amount of desired aliasing in the image information captured by the sampling circuitry.

15. The array camera module of claim 14 , wherein the pixel aperture is formed by a microlens that is smaller than the pixel area.

16. The array camera module of claim 15 , wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in a particular one of the plurality of focal planes.

17. The array camera module of claim 16 , wherein light is prevented from entering the pixel stacks of the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes through the gaps between the microlenses by a light blocking material.

18. The array camera module of claim 17 , wherein photoresist is located in the gaps between the microlenses.

19. The array camera module of claim 15 , wherein the amount of aliasing in images captured by a one of the plurality of focal planes is greater than the amount of aliasing that would be present were the microlens of the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes to occupy the entire pixel area defined by the pixel stack.

Assignments (13)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2018
From: FOTONATION CAYMAN LIMITED
To: FOTONATION LIMITED
Reel/Frame 046539/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: PELICAN IMAGING CORPORATION
To: FOTONATION CAYMAN LIMITED
Reel/Frame 040675/0025 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: KIP PELI P1 LP
To: PELICAN IMAGING CORPORATION
Reel/Frame 040674/0677 →
CHANGE OF NAME Recorded Oct 19, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE SPECIAL OPPORTUNITIES FUND LP
Reel/Frame 040423/0725 →
CHANGE OF NAME Recorded Oct 19, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE SPECIAL OPPORTUNITIES FUND LP
Reel/Frame 040494/0930 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2016
From: LELESCU, DAN; VENKATARAMAN, KARTIK
To: PELICAN IMAGING CORPORATION
Reel/Frame 039925/0970 →
SECURITY INTEREST Recorded Jun 13, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE OPPORTUNITIES FUND LP
Reel/Frame 039117/0345 →
SECURITY INTEREST Recorded Jun 13, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE OPPORTUNITIES FUND LP
Reel/Frame 038982/0151 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR AND ASSIGNEE PREVIOUSLY RECORDED AT REEL: 037565 FRAME: 0439. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jan 25, 2016
From: KIP PELI P1 LP
To: DBD CREDIT FUNDING LLC
Reel/Frame 037591/0377 →
SECURITY INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: KIP PELI P1 LP
Reel/Frame 037565/0439 →
SECURITY INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: DBD CREDIT FUNDING LLC
Reel/Frame 037565/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: KIP PELI P1 LP
Reel/Frame 037565/0385 →