Electrical connection arrangement
View Patent ↗A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.
1. A connection arrangement comprising:
a printed circuit board;
a semiconductor component arranged on a first surface of a first side of the printed circuit board;
a connection means arranged on a second surface of a second side of the printed circuit board opposite the first surface and the first side;
a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component; and
a holding means operable to releasably press together the contact element and the connection means;
wherein the holding means is adapted such that upon an actuation of the holding means, the contact element is pressed against the connection means and a part of the holding means is pressed against the semiconductor component; and
wherein the holding means has a U-shaped cross section that defines two legs are parallel to each other, and an eccentric is attached to one of the two legs such that the eccentric is pivotable into a space between the two legs.
2. The connection arrangement according to claim 1 , wherein the connection means is formed from a portion of a second conductive coating of the printed circuit board.
3. The connection arrangement according to claim 1 , wherein the semiconductor component and the connection means are arranged spaced apart from an edge of the printed circuit board.
4. The connection arrangement according to claim 1 , wherein a second semiconductor component is arranged on the first surface of the first side of the printed circuit board and is directly electrically connected to the contact element.
5. The connection arrangement according to claim 1 , wherein the semiconductor component is electrically connected at least with a portion of a conductive coating extending between the semiconductor component and a substrate of the printed circuit board.
6. The connection arrangement according to claim 1 , wherein the connection means is formed from a portion of a second conductive coating of the printed circuit board, and an area of the connection means is larger than an area of the conductive coating of the printed circuit board, which is arranged between the semiconductor component and substrate.
7. The connection arrangement according to claim 1 , wherein the printed circuit board comprises at least one via in the area between the semiconductor component and the connection means.
8. The connection arrangement according to claim 1 , wherein the contact element has a planar surface which is adapted to provide an electrical connection to the connection means.
9. The connection arrangement according to claim 1 , wherein the contact element comprises means for cooling.
10. The connection arrangement according to claim 1 , wherein the holding means comprises means for cooling.
11. The connection arrangement according to claim 1 , wherein the connection arrangement is suitable for high current applications.
12. The connection arrangement according to claim 1 , wherein the electrical line comprises an insulating layer.
13. The connection arrangement according to claim 12 , wherein the electrical line comprises a braid with a plurality of wires and the insulating layer encircles the braid.