Image pickup panel and image pickup processing system
View Patent ↗An image pickup panel ( 1 ) includes: photodetection sections ( 10 ) each including a photodetector ( 11 - 1 ) and a receiver ( 11 - 2 ) which are integrally molded and having solder bumps ( 12 ) formed thereon, the photodetector converting received light into a current signal, the receiver converting the current signal into a voltage signal; and a wiring layer ( 20 ) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.
1. An image pickup panel:
a substrate;
a plurality of photodetection sections over the substrate,
wherein each of the photodetection sections includes at least one photodetector which converts received light into a current signal, a receiver converting the current signal into a voltage signal, and a plurality of connection elements, and
wherein the substrate includes a wiring layer which connects each of the photodetection sections via the connection elements; and
a flexible substrate including protrusions formed on the photodetection sections side thereof, the protrusions having tips located for the respective photodetection sections toward light-receiving surfaces of the photodetection sections to totally reflect light emitted from a fluorescent medium, and then to focus the light on the light-receiving surfaces of the photodetection sections, the fluorescent medium covering all of the light-receiving surfaces of the photodetection sections and converting incident radiation rays into light to emit the light,
wherein the connection elements are mounted between recessions between any adjacent ones of the protrusions on the flexible substrate and the wiring layer.
2. The image pickup panel according to claim 1 , wherein each of the photodetection sections comprises a photodetection chip.
3. An image pickup panel comprising:
a substrate;
a plurality of photodetection sections over the substrate,
wherein each of the photodetection sections includes at least one photodetector which converts received light into a current signal, a receiver converting the current signal into a voltage signal, and a plurality of connection elements, and
wherein the substrate includes a wiring layer which connects each of the photodetection sections via the connection elements; and
lens sections each configured through forming a plurality of connection elements on a lens which focuses light on a light-receiving surface of each of the photodetection sections,
wherein the lens sections are connected for the respective photodetection sections on the wiring layer.
4. The image pickup panel according to claim 3 , wherein each of the photodetection sections comprises a photodetection chip.