Electronic component package
View Patent ↗Provided is an electronic component package that does not lower reliability while enabling miniaturization and high performance of the electronic component package. The electronic component package includes a main substrate, a first electronic component provided on a main surface of the main substrate, a frame body disposed so as to face the main surface of the main substrate, and a first connection terminal and a second connection terminal disposed on the main surface of the main substrate along a first side of the frame body. The second connection terminal is disposed on the first side of the frame body at a position facing a vicinity of a midpoint of a side of the first electronic component, and the second connection terminal has an area larger than an area of the first connection terminal.
1. An electronic component package comprising:
a main substrate;
a first electronic component provided on a main surface of the main substrate;
a frame body disposed so as to face the main surface of the main substrate; and
a first connection terminal and a second connection terminal, each of which is disposed on the main surface of the main substrate along a first side of the frame body,
wherein the second connection terminal is disposed on the first side of the frame body at a position facing a vicinity of a midpoint of a side of the first electronic component, and
the second connection terminal has an area larger than an area of the first connection terminal.
2. The electronic component package according to claim 1 , wherein a side of the second connection terminal in a direction parallel to the first side is longer than a side of the first connection terminal.
3. The electronic component package according to claim 1 , wherein a side of the second connection terminal in a direction perpendicular to the first side is longer than the side of the first connection terminal.
4. The electronic component package according to claim 1 , wherein resin is filled between the main surface of the main substrate and the frame body at a portion of the first side.
5. The electronic component package according to claim 4 , wherein the first electronic component is disposed on the main surface of the main substrate via resin which is the same as the resin filled between the main surface of the main substrate and the frame body.
6. The electronic component package according to claim 1 , wherein a second electronic component is provided on the main surface of the main substrate, and the first electronic component has an area larger than an area of the second electronic component.
7. The electronic component package according to claim 1 , wherein the first electronic component is a semiconductor chip.
8. The electronic component package according to claim 1 , wherein a width of a side of a bottom surface of the frame body at a position facing the second connection terminal is wider than a width of a side of the bottom surface of the frame body at another position.
9. The electronic component package according to claim 1 , wherein the second connection terminal is a dummy terminal.
10. The electronic component package according to claim 1 , wherein the second connection terminal is connected to a ground part.
11. The electronic component package according to claim 1 , wherein a first external terminal and a second external terminal are disposed on a bottom surface of the frame body,
the second external terminal is electrically connected with the second connection terminal, and
the second external terminal has an area larger than an area of the first external terminal.
12. The electronic component package according to claim 11 , wherein a third external terminal and a fourth external terminal are disposed on a main surface of the frame body, and
the fourth external terminal has an area larger than an area of the third external terminal.
13. The electronic component package according to claim 12 , wherein the fourth external terminal is provided at a position facing the second external terminal.
14. The electronic component package according to claim 12 , wherein the forth external terminal is provided on the main surface of the frame body at a corner of a side, of sides on the main surface, facing the first side.
15. The electronic component package according to claim 1 , wherein the first side of the frame body is a side, of the respective sides of the frame body, whose distance from the first electronic component is the shortest.