Gate insulator layer for organic electronic devices
View Patent ↗Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as gate insulator layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin gate insulator and processes for preparing such polycycloolefin gate insulator layers and electronic devices encompassing such layers.
1. A polymer composition for forming an organic gate insulating layer, said composition comprising a solvent, a norbornene-type polymer and one or more of (1) a crosslinking agent, (2) a UV sensitizer or (3) an adhesion promoter wherein the norbornene-type polymer comprises repeating units of the formula (I) derived from a norbornene-type monomer by addition polymerization,
wherein
Z is —CH 2 — or —CH 2 —CH 2 —,
m is an integer from 0 to 3,
R 1 R 2 , R 3 and R 4 are the same or different and are independently selected from hydrogen, hydrocarbyl, halohydrocarbyl or perhalohydrocarbyl or where one or more of the carbons atoms in the hydrocarbyl, halohydrocarbyl or perhalohydrocarbyl is replaced by a heteroatom containing moiety selected independently from O, N, P, or Si,
with the proviso that at least one of R 1 , R 2 , R 3 and R 4 has a pendent crosslinkable group.
2. The polymer composition of claim 1 , wherein said monomer is selected from DMMIMeNB, DMMIEtNB, DMMIPrNB or DMMIBuNB
3. The polymer composition of claim 1 , wherein the UV sensitizer is 1-chloro-4-propoxythioxanthone (CPTX) and the solvent is methyl n-amyl ketone (MAK), cyclohexanone or cyclopentanone.
4. The polymer composition of claim 1 , wherein the crosslinking agent is DMMI-butylene-DMMI, DMMI-pentylene-DMMI or DMMI-hexylene-DMMI.
5. The polymer composition of claim 1 , wherein the adhesion promoter is DMMI-propylene-Si(OEt) 3 , DMMI-butylene-Si(OEt) 3 , DMMI-butylene-Si(OMe) 3 or DMMI-hexylene-Si(OMe) 3 .
6. The polymer composition of claim 1 , wherein the monomer is BuNB, HexNB, OctNB, DecNB, NBC 4 F 9 or PPVENB
7. The polymer composition of claim 1 , wherein the polymer is derived from at least two monomers and said at least one monomer is BuNB, HexNB, OctNB or DecNB,
and said at least other monomer is EONB, MGENB, DMMIMeNB, DMMIEtNB, DMMIPrNB, DMMIBuNB or DMMIHxNB
8. The polymer composition of claim 1 , wherein the monomer is EONB, MGENB, DMMIMeNB, DMMIEtNB, DMMIPrNB, DMMIBuNB and DMMIHxNB
9. The polymer composition as claimed in claim 1 , wherein R 1 , R 2 ′, R 3 , and R 4 are identical or different and are an hydrogen, C 1 -C 25 alkyl, a C 2 -C 24 alkenyl, a C 2 -C 24 alkynyl, a C 5 -C 25 cycloalkyl, a C 6 -C 24 aryl or a C 7 -C 24 aralkyl, or where at least one of the hydrogen atom in the alkyl, alkenyl, alkynyl, cycloalkyl, aryl or aralkyl is replaced by a halogen atom, or
ether, epoxy, glycidyl ether, alcohol, carboxylic acid, ester, ketone, anhydride, maleimide, amine, imine, amide, phenol, amido-phenol, silane, siloxane, phosphine, phosphine oxide, phosphinite, phosphonite, phosphite, phosphonate, phosphinate, or phosphate.
10. The polymer composition as claimed in claim 1 , wherein the polymer has one or more the repeating units of the formula (I) and one or more repeating units of the formula (II)
wherein
Z is —CH 2 — or —CH 2 —CH 2 —,
m is an integer from 0 to 3,
R 5 , R 6 , R 7 and R 8 are the same or different and are independently selected from hydrogen, hydrocarbyl, halohydrocarbyl or perhalohydrocarbyl or where one or more of the carbons atoms in the hydrocarbyl, halohydrocarbyl or perhalohydrocarbyl is replaced by a heteroatom containing moiety selected independently from O, N, P, or Si,
the repeating units of formula (I) being distinct from the repeating units of formula (II).
11. The polymer composition of claim 1 , wherein the crosslinking agent is DMMI-butylene-DMMI, DMMI-pentylene-DMMI or DMMI-hexylene-DMMI and the adhesion promoter is DMMI-propylene-Si(OEt) 3 , DMMI-butylene-Si(OEt) 3 , DMMI-butylene-Si(OMe) 3 or DMMI-hexylene-Si(OMe) 3 .
12. A polymer composition for forming an organic gate insulating layer,
said polymer composition comprises (a) a solvent, (b) a norbornene-type polymer and (c) one or more of (1) a crosslinking agent, (2) a UV sensitizer or (3) an adhesion promoter, wherein the norbornene-type polymer comprises
repeating units derived from at least two monomers by addition polymerization, wherein said at least one monomer is selected from BuNB, HexNB, OctNB or DecNB,
and wherein said at least other monomer is selected from EONB, MGENB, DMMIMeNB, DMMIEtNB, DMMIPrNB, DMMIBuNB or DMMIHxNB
13. A polymer composition for forming an organic gate insulating layer,
said polymer composition comprises (a) a solvent, (b) a norbornene-type polymer and (c) one or more of (1) a crosslinking agent, (2) a UV sensitizer or (3) an adhesion promoter, wherein the norbornene-type polymer comprises
repeating units derived from a norbornene-type monomer by addition polymerization, wherein said monomer is selected from EONB, MGENB, DMMIMeNB, DMMIEtNB, DMMIPrNB, DMMIBuNB and DMMIHxNB,