IP Library Granted Patent US 9,747,488
Granted Patent B2
US 9,747,488 · App. 14/823,945 · Granted Aug 29, 2017

Active sensing element for acoustic imaging systems

Inventors: Mohammad Yeke Yazdandoost (Cupertino, CA); Giovanni Gozzini (Cupertino, CA); Jean-Marie Bussat (Cupertino, CA)
Assignee: Apple Inc.
G06K9/0002
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Quick Facts
Patent No.
US 9,747,488
App. No.
14/823,945
Granted
Aug 29, 2017
Kind
B2
Abstract

An acoustic fingerprint imaging system having a plurality of acoustic elements, each acoustic element including a transducer, and independent drive and sense circuitry is disclosed. Drive circuitry may require higher voltage than low voltage sense circuitry. Many embodiments described herein include a ground shifting controller to apply a voltage bias to the low voltage sense circuitry during a drive operation, in order to prevent electrical damage to the sense circuitry.

Claims (37)

1. An acoustic imaging sensor comprising:

a high voltage node;

a low voltage node;

an acoustic element in communication with a bottom surface of a substrate, configured to produce an acoustic input into the substrate, the acoustic element comprising:

an ultrasonic transducer;

a drive circuit configured to couple the ultrasonic transducer to the high voltage node and generate the acoustic input; and

a sense circuit coupled to the low voltage node and configured to obtain an acoustic output from the substrate; and

a controller configured to increase a voltage bias of the sense circuit when the drive circuit is active to a voltage approximately equal to a voltage bias of the high voltage node.

2. The acoustic imaging sensor of claim 1 , wherein the acoustic imaging sensor is a biometric imaging sensor.

3. The acoustic imaging sensor of claim 1 , wherein the acoustic imaging sensor is configured to capture an image of a fingerprint.

4. The acoustic imaging sensor of claim 1 , wherein the substrate is formed from an optically transparent material.

5. The acoustic imaging sensor of claim 1 , wherein the substrate is formed from one of the group consisting of glass, sapphire, and metal.

6. The acoustic imaging sensor of claim 1 , wherein the ultrasonic transducer is formed from a material configured to expand in response to a high voltage pulse.

7. The acoustic imaging sensor of claim 1 , wherein the high voltage node is coupled to a high voltage source configured to output 100 volts.

8. The acoustic imaging sensor of claim 1 , wherein the low voltage node is coupled to a low voltage source configured output less than 10 volts.

9. The acoustic imaging sensor of claim 1 , wherein the controller is configured to raise the voltage bias of the sense circuit to a voltage greater than or equal to one hundred volts.

10. The acoustic imaging sensor of claim 9 , wherein raising the voltage bias of the sense circuit to a voltage approximately equal to the voltage bias of the high voltage node comprises ground shifting the sense circuit.

11. The acoustic imaging sensor of claim 9 , wherein ground shifting the sense circuit comprises applying a direct current voltage bias to the low voltage node and to a circuit ground of the sense circuit.

12. A method of driving an acoustic element comprising a high voltage drive circuit and a low voltage sense circuit, the method comprising:

increasing a voltage bias of the low voltage sense circuit approximately equal to a voltage bias of the high voltage drive circuit such that a potential difference between a voltage source of the low voltage sense circuit and a circuit ground of the low voltage sense circuit does not exceed a selected threshold; and

applying a high voltage drive signal to an ultrasonic transducer coupled to the high voltage drive circuit.

13. The method of claim 12 , wherein the acoustic element comprises an acoustic transducer formed from a material configured to expand in response to a high voltage pulse.

14. The method of claim 12 , wherein the high voltage drive circuit is coupled to a high voltage source configured to output 100 volts.

15. The method of claim 14 , wherein the low voltage sense circuit is coupled to a low voltage node configured to output approximately 3.3 volts.

16. The method of claim 12 , wherein increasing a voltage bias of the low voltage sense circuit comprises raising the voltage bias of the low voltage sense circuit to a voltage greater than or equal to one hundred volts.

17. The method of claim 16 , wherein raising the voltage bias of the low voltage sense circuit to a voltage approximately equal to the voltage of the high voltage drive circuit comprises ground shifting the low voltage sense circuit.

18. The method of claim 17 , wherein ground shifting the sense circuit comprises applying a direct current voltage bias to the low voltage node and to a circuit ground of the sense circuit.

19. A method of reading an output of an acoustic element of an acoustic fingerprint imaging system comprising a high voltage drive circuit and a low voltage sense circuit, the method comprising:

increasing a voltage bias of the low voltage sense circuit to a voltage approximately equal to a voltage bias of the high voltage drive circuit such;

applying a high voltage drive signal to an ultrasonic transducer coupled to the high voltage drive circuit

removing the voltage bias of the low voltage sense circuit such that a potential difference between a voltage source of the low voltage sense circuit and a circuit ground of the low voltage sense circuit does not exceed a selected threshold;

decreasing a voltage bias of the high voltage drive circuit such that the potential difference between a voltage source of the high voltage drive circuit and a circuit ground of the high voltage drive circuit is approximately zero volts;

applying a reset voltage signal to the low voltage sense circuit; and

measuring a voltage output from the low voltage sense circuit.

20. The method of claim 19 , wherein the acoustic element comprises an acoustic transducer formed from a material configured to expand in response to a high voltage pulse.

21. The method of claim 19 , wherein the high voltage drive circuit is coupled to a high voltage source configured to output 100 volts.

22. The method of claim 19 , wherein the low voltage sense circuit is coupled to a low voltage node configured to output approximately 3.3 volts.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2015
From: YAZDANDOOST, MOHAMMAD YEKE; GOZZINI, GIOVANNI; BUSSAT, JEAN-MARIE
To: APPLE INC.
Reel/Frame 036302/0512 →
Continuity (2)
Provisional Application 62057921 · Sep 30, 2014
Related Publication 20160092716A1 · Mar 31, 2016