Granted Patent B2

US 9,996,788 · App. 14/825,986 · Granted Jun 12, 2018

Abstract

Claims (28)

1. A method of producing an electronic device, comprising the steps of:

applying an adhesive material in a first pattern on a surface of a first substrate;

bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;

activating the adhesive material;

separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate;

applying a further adhesive material in a second pattern on top of the transferred metal foil;

forming a via from a top surface of the further adhesive material to the transferred metal foil; and

depositing a metallic material on top of the second pattern;

wherein the metallic material is conductively coupled to a portion of the transferred metal foil.

2. The method of claim 1 , wherein the step of applying the further adhesive material includes the step of applying the further adhesive material such that no portion of the second pattern of the further adhesive material extends beyond the first pattern of adhesive material.

3. The method of claim 1 , wherein the transferred metal foil and the metallic material are conductively coupled through the via.

4. The method of claim 1 , further including the step of applying a non-conductive material between the further adhesive material and the transferred metal foil.

5. The method of claim 4 , wherein the non-conductive material has a thickness between 200 Angstroms and 10,000 Angstroms.

6. The method of claim 4 , further including the steps of forming a first via from a top surface of the further adhesive material to a top surface of the non-conductive material, and forming a second via from a top surface of the non-conductive material to a top surface of the transferred metal foil, wherein first via and the second via combine to couple the top surface of the further adhesive material with the top surface of the metal foil.

7. The method of claim 6 , wherein a diameter of the first via is substantially different than a diameter of the second via.

8. The method of claim 1 , wherein the first pattern of the adhesive material has a thickness between 200 and 10,000 Angstroms.

9. The method of claim 1 , wherein activating the adhesive includes activating the adhesive while the portion of the metal foil is in contact with the adhesive material.

10. The method of claim 1 , wherein activating the adhesive includes applying energy to activate the adhesive.

11. The method of claim 10 , wherein the energy includes at least one of mechanical pressure and heat.

12. A method of producing an electronic device, comprising the steps of:

jetting an adhesive material in a first pattern on a surface of a first substrate;

bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;

activating the adhesive material;

separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate;

applying a further adhesive material in a second pattern on top of the transferred metal foil;

depositing a metallic material on top of the second pattern; and

forming a via from a top surface of the further adhesive material to the transferred metal foil;

wherein the metallic material is conductively coupled to a portion of the transferred metal foil.

Assignments (19)