Light-emitting diode chip

1. A light-emitting diode (LED) chip comprising:

a first semiconductor layer;

an active layer disposed on the first semiconductor layer;

a second semiconductor layer disposed on the active layer;

one or a plurality of indentations, comprising a bottom part extending downward through the second semiconductor layer and the active layer to reach the first semiconductor layer and exposing the first semiconductor layer;

a plurality of metal layers, comprising a first metal layer connecting to the first semiconductor layer through the bottom part, and a second metal layer deposited on the first metal layer; and

an insulating layer formed between the first and the second metal layers, disposed on the indentation and covering the first metal layer,

wherein the second metal layer comprises one or a plurality of recesses at a top surface thereof corresponding to the one or plurality of indentations.

2. The LED chip as claimed in claim 1 , further comprising a first electrode connecting to the first metal layer; and a second electrode connecting to said second metal layer; wherein the first electrode is located on one side of the LED chip, and the second electrode is located on another side of the LED chip.

3. The LED chip as claimed in claim 1 , further comprising:

another insulating layer contacting the second semiconductor layer; and

a transparent conductive layer disposed on the another insulating layer.

4. The LED chip as claimed in claim 3 , wherein the transparent conductive layer contacts an area of the second semiconductor layer outside the another insulating layer.

5. The LED chip as claimed in claim 3 , wherein the another insulating layer has a width larger than that of the first metal layer.

6. The LED chip as claimed in claim 1 , further comprising a first electrode contacting the first semiconductor layer and connecting to the first metal layer.

7. The LED chip as claimed in claim 6 , wherein the first electrode has a width larger than that of the first metal layer.

8. The LED chip as claimed in claim 6 , wherein the insulating layer exposes the first electrode.

9. The LED chip as claimed in claim 1 , wherein the one or the plurality of indentations comprise side surfaces connecting to the bottom part, and the side surfaces are inclined.

10. The LED chip as claimed in claim 1 , wherein the first metal layer covers side surfaces of each indention to connect to the first semiconductor layer.

11. The LED chip as claimed in claim 1 , wherein the insulating layer is disposed along side surfaces of each indentation.